Computationally Efficient Approaches to Characterize the Dynamic Response of Microstructures Under Mechanical Shock

Younis, Mohammad I.; Jordy, Daniel; Pitarresi, James M.

doi:10.1109/jmems.2007.896701

Cited by 63 publications

(43 citation statements)

References 26 publications

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“…In MEMS devices that contain movable structures, including accelerometers, gyroscopes, and micromirrors, fracture can result from various causes: mechanical shock and overload [3], corrosion [4], stress corrosion cracking (SCC) [5]- [8], and material fatigue [9]. An example of a fractured MEMS cantilever is presented in Fig.…”

Section: Mechanical Fracturementioning

confidence: 99%

“…Tanner et al [14] tested MEMS microengines against shock pulses of various time durations and amplitudes and observed broken mechanical components, e.g., gear anchor, pin joint, and linkage arm, in their comb-drive actuators. M. Younis et al [3] presented a Galerkin-based reduced-order model that is capable of accurately capturing the dynamic behavior of micro-cantilevers and clamped-clamped micro-beams under shock pulsing of various amplitudes (low-g and high-g). Avoiding stress concentration by filleting sharp points, lines, and corners is an effective way to prevent fracture.…”

Section: Mechanical Fracturementioning

confidence: 99%

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MEMS Reliability Review

Huang

Vasan

Doraiswami

et al. 2012

IEEE Trans. Device Mater. Relib.

158

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Abstract-Microelectromechanical systems (MEMS) represents a technology that integrates miniaturized mechanical and electromechanical components (i.e., sensors and actuators) that are made using microfabrication techniques. MEMS devices have become an essential component in a wide range of applications, ranging from medical and military to consumer electronics. As MEMS technology is implemented in a growing range of areas, the reliability of MEMS devices is a concern. Understanding the failure mechanisms is a prerequisite for quantifying and improving the reliability of MEMS devices. This paper reviews the common failure mechanisms in MEMS, including mechanical fracture, fatigue, creep, stiction, wear, electrical short and open, contamination, their effects on devices' performance, inspection techniques, and approaches to mitigate those failures through structure optimization and material selection.

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Section: Mechanical Fracturementioning

confidence: 99%

Section: Mechanical Fracturementioning

confidence: 99%

MEMS Reliability Review

Huang

Vasan

Doraiswami

et al. 2012

IEEE Trans. Device Mater. Relib.

158

View full text Add to dashboard Cite

show abstract

“…The above approach works accurately for linearly behaving microstructures, such as cantilever microbeams [35]. For microstructures with geometric nonlinearities, such as clamped-clamped beams, the amplification factor A dyn /A stat becomes less accurate (since it is based on a linear SRS).…”

Section: Computationally Efficient Approach For Microstructuresmentioning

confidence: 99%

“…Such high level of shock loads can induce complex dynamical responses. From a computational point of view, modeling such problems using finite-element techniques is very cumbersome [35].…”

Section: High-g Shock Responsementioning

confidence: 99%

“…In [28][29][30][31][32][33][34] the response of microstructures under the combined effects of mechanical shock and electrostatic forces has been investigated theoretically and experimentally. Computationally efficient approaches to study shock in MEMS were presented in [35]. The effect of the PCB motion on the response of a microstructure has been studied theoretically and experimentally in [31,36,37].…”

Section: Introductionmentioning

confidence: 99%

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Mechanical Shock in MEMS

Younis

2011

Microsystems

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This chapter addresses a reliability issue of MEMS that is crucial for their commercialization, which is their survivability under mechanical shocks. Unlike conventional electronics of passive elements, MEMS contain flexible components that are deliberately designed to undergo some kind of motion. Thus, a natural question comes of how these microstructures respond when they are subjected to dynamic shock loads? What about short circuit and stiction when they make contacts with the substrate or stationary electrodes due to shock loads? These are some of the issues that are treated in this chapter. In addition, the impact of electrostatic forces on the dynamic response is illustrated. The interaction of the motion of microstructures with the printed circuit boards where they are mounted on is also discussed. IntroductionWith the rapid growth and maturity of the MEMS technology, many device concepts are ready to make the transition from research labs to consumer products. One of the critical issues affecting the commercialization of MEMS devices is their reliability and survivability under mechanical shock and impact. Several MEMS components have already made it to the market and being increasingly integrated and embedded into handheld devices and consumer products, such as the interactive motion-sensitive video games and smart phones. In such environments, there is an obvious need to ensure the durability and reliability of MEMS to sustain the various dynamic loads while being used by consumers.MEMS generally can be exposed to shock during fabrication, deployment, shipping, and operation. Also, a crucial criterion for automotive and industrial applications is the survivability of portable devices containing MEMS when dropped on hard surfaces, which can induce significant shock loads. For some applications, MEMS are expected to survive sever dynamic loading, such as the harsh environments in military applications. In addition, aerospace applications rely on pyrotechnic devices, which generate dangerous shock waves of amplitude reaching hundreds of thousands of gs. MEMS sensors and devices in these applications are required to survive such severe environments.

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Waterproof, Anti‐Impacted, and Ultrathin Carbon‐Based Air Pressure Sensors Toward Aerodynamic Tests on High‐Speed Trains

Chen

Wang

et al. 2022

Adv Eng Mater

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Air pressure sensors play a crucial role in aerodynamic tests on high‐speed trains, especially when the aerodynamic problems become more significant when the speed of high‐speed trains increases. The air pressure sensors used for aerodynamic testing of high‐speed trains are currently based on microelectromechanical systems (MEMS), which are thick, difficult to adjust linear range, and easily damaged by overloading force and water, thus cannot satisfy all‐weather train aerodynamic monitoring. Herein, a flexible ultrathin air pressure sensor for aerodynamic testing of high‐speed trains is reported; this sensor is based on a sensing material of carbon fiber beams and a sealed microchamber structure. The microchamber structure model allows the sensor to achieve high sensitivity in the target linear range by adjusting the initial internal pressure of the sealed microchamber. Meanwhile, the sealed microchamber structure enables the sensor to be waterproof and anti‐impacted. The sensor can work in water for at least 500 min and remain undamaged after being run over by a car with a weight of approximately 1550 kg. Furthermore, this air pressure sensor has been successfully applied in real‐time train surface pressure monitoring and shows the fantastic perspective for sensors toward aerodynamic tests on the high‐speed trains.

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Computationally Efficient Approaches to Characterize the Dynamic Response of Microstructures Under Mechanical Shock

Cited by 63 publications

References 26 publications

MEMS Reliability Review

MEMS Reliability Review

Mechanical Shock in MEMS

Waterproof, Anti‐Impacted, and Ultrathin Carbon‐Based Air Pressure Sensors Toward Aerodynamic Tests on High‐Speed Trains

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