2012 IEEE International Symposium on Electromagnetic Compatibility 2012
DOI: 10.1109/isemc.2012.6351691
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Computational study of external fixation devices surface heating in MRI RF environment

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Cited by 9 publications
(9 citation statements)
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“…The heating can be related to many factors, e.g. incident tangential electric field distribution, insertion depth of pin inside the ASTM phantom gel and nonconductive material used at the connection part on the device (Liu et al, 2012a). In this study, the device is placed at a location where high incident tangential electric field is observed.…”
Section: Devicementioning
confidence: 99%
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“…The heating can be related to many factors, e.g. incident tangential electric field distribution, insertion depth of pin inside the ASTM phantom gel and nonconductive material used at the connection part on the device (Liu et al, 2012a). In this study, the device is placed at a location where high incident tangential electric field is observed.…”
Section: Devicementioning
confidence: 99%
“…The connection bar has a diameter of 1.1 cm and a length of 41.5 cm. From a previous study (Liu et al, 2012a), four different insertion depths are used and a shallow insertion of 2 cm is found to produce the highest RF heating. In this study, the 2 cm insertion depth is used for all studies.…”
Section: Devicementioning
confidence: 99%
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