Comprehensive material characterization of organic packaging materials

Abstract

In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme. In addition, two low filled packaging polymers are included for comparison. The characterization scheme consists of the steps sample preparation, measurement of the material data, and modeling the material behavior. The dasiasample preparationpsila step included a DSC analysis to understand the cure reaction and to establish the cure kinetics model. In the dasiameasurementpsila step, two different sets of equipment were applied. The elongation modulus is determined by dynamic mechanical analysis (equipment: DMA dasiaQ800psila) in a wide range of temperatures and frequencies. The other parameters are measured by pressure-volume-temperature experiments (equipment: PVT dasiaGnomixpsila). Conducting these characterization tests, the bulk modulus (K), coefficient of thermal expansion (CTE), and the cure shrinkage was determined. The paper describes this comprehensive characterization with the measurement setups and parameter selection. E(T,t), K(T,t), CTE(T), Tg and cure shrinkage are determined to define a complete and consistent material model [JAN07]. Subsequently, the characterization results are presented, discussed and further work to implement the complete material model into FEM simulation tools like ANSYStrade is outlined

Reliability of embedding concepts for discrete passive components in organic circuit boards

“…During the lamination or autoclave process the preformed composite materials (prepregs) with fibers and matrix start to join. At high temperature the polymer monomers and oligomers start to crosslink and the laminate and resins develop their mechanical properties (fully cured polymer matrix) [7]. Because this is considered a critical step during the manufacturing process, the cool down from the high processing temperature to ambient temperature of the specimens have been assessed with the finite element modeling framework described in the previous section.…”

Effect of carbide powder characteristics on the PVT behavior of powder injection molding compounds

“…The results of the study proved that the calculated shrinkage and hold pressure could be used to effectively control dimensions of the final sintered components. Boehme et al [5] measured coefficient of thermal expansion and curing shrinkage for two (vitreous silica and carbon black) highly-filled (82-94 wt.%) resins. Crosslinking kinetic was evaluated using DSC and PVT.…”