2009 59th Electronic Components and Technology Conference 2009
DOI: 10.1109/ectc.2009.5074275
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CNTs - a comparable study of CNT-filled adhesives with common materials

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Cited by 5 publications
(2 citation statements)
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“…Therefore, the strong decrease in the intrinsic viscosity value was observed for this concentration of MWCNT. Probably, it was because of the fact that CNT on polymer melt show typical thixotropic, so when the stirring was stopped (before extrusion from the reactor), the nanocomposite melt almost completely covered the stirrer, and it was almost impossible to extruded it from the reactor. Therefore, the highest content of CNT achieved in the prepared nanocomposites was 0.3 wt%, and thus introduction of higher content of MWCNT was not possible because the melt does not flow.…”
Section: Resultsmentioning
confidence: 99%
“…Therefore, the strong decrease in the intrinsic viscosity value was observed for this concentration of MWCNT. Probably, it was because of the fact that CNT on polymer melt show typical thixotropic, so when the stirring was stopped (before extrusion from the reactor), the nanocomposite melt almost completely covered the stirrer, and it was almost impossible to extruded it from the reactor. Therefore, the highest content of CNT achieved in the prepared nanocomposites was 0.3 wt%, and thus introduction of higher content of MWCNT was not possible because the melt does not flow.…”
Section: Resultsmentioning
confidence: 99%
“…2,3 With growing interest in producing smaller-sized electronics with higher power densities, the electronic packaging industry is tasked with finding a heat management solution to accommodate the increased need for heat dissipation. 3,4 Traditionally, thermal dissipation in encapsulated devices has been resolved through the use of embedded heat sinks. 3,5 Although this solution may have been appropriate in the past, the evolution of semiconductor technology now requires higher heat dissipation for smaller electronics.…”
Section: Introductionmentioning
confidence: 99%