Composite solders

Marshall, James L.; Calderon, J.; Sees, Jennifer A.; Lucey, G. K.; Hwang, J.S.

doi:10.1109/33.105119

Cited by 48 publications

(25 citation statements)

References 10 publications

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“…3 The effect of additional phases on the microstructure, wettability, and other mechanical properties of the composite solder have been reported. [4][5][6][7][8][9] In bulk materials, the results of Marshall et al 10 showed that the mechanical properties of a powdered, Cu 6 Sn 5 intermetallic reinforced-composite solder were superior to those of the standard SnPb solder. Again, using bulk solder materials, Clough et al 11 reported that with properly controlled porosity Cu 6 Sn 5 /eutectic Sn-Pb composite solders exhibited twice the yield strength without significant ductility loss and also showed nearly an order of magnitude lower creep rate in comparison to unreinforced solders.…”

Section: Introductionmentioning

confidence: 97%

Study on Cu particles-enhanced SnPb composite solder

Yan

Liu

Shi

et al. 2004

Journal of Elec Materi

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The Sn-Pb solder is widely used in the electronics industry. With the development of surface mount technology and miniaturization of elements, mechanical properties of the solder are critical. Creep resistance and size stability of soldered joints are important for optical electronics. In the present work, Cu particles with a size of about 8 µm were added to the eutectic 63Sn-37Pb solder to improve the creep property of the soldering alloy. The contents of the Cu particles are 5 vol.% and 10 vol.% separately. The solder matrix is 63Sn37Pb particles with a normal size of 43 µm. The composite solder pastes are manufactured from a mixture of these particles with no-clean flux. Under reflow soldering, the metal particles were uniformly dispersed in the Sn-Pb alloy, and very thin intermetallic compounds were formed between the particles and matrix. To simulate practical soldering of printed circuit boards, a specially designed mini specimen with lap joint is used for the creep-rupture test. For the condition of ambient temperature, the creep-rupture lifetime of the soldered joint can be increased by one order quantitatively using the composite solder compared to the 63Sn37Pb eutectic solder. Other mechanical properties are measured also. In addition, the wetting property of the enhanced solder is good through the wettability test.

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Section: Introductionmentioning

confidence: 97%

Study on Cu particles-enhanced SnPb composite solder

Yan

Liu

Shi

et al. 2004

Journal of Elec Materi

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“…15 Microstructural evolution of solder alloys was proven to be the primary factor to influence the reliability of solder alloys. 1,[10][11][12][13][14]16 However, there is still a lack of knowledge about lead-free solders with Bi addition, especially the relationship between the microstructure of the solder alloys as a function of processing parameters and mechanical properties of the solders. Microhardness testing is considered the easiest way to determine the mechanical properties of materials, especially for solder alloys, which are composed of both soft and hard phases.…”

Section: Introductionmentioning

confidence: 99%

“…[7][8][9][10][11][12][13][14] Bismuth was a potential candidate, which can be used to form the composite lead-free solder with high reliability and low melting temperature. The reducing of melting temperature for solder alloys was reported by adding different amounts of Bi to the solder alloy.…”

Section: Introductionmentioning

confidence: 99%

Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys

Acoff

2006

Journal of Elec Materi

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This work investigates the effect of reflow and the thermal aging process on the microstructural evolution and microhardness of five types of Sn-Ag based lead-free solder alloys: Sn-3.7Ag, Sn-3.7Ag-1Bi, Sn-3.7Ag-2Bi, Sn-3.7Ag-3Bi, and Sn-3.7Ag-4Bi. The microhardness and microstructure of the solders for different cooling rates after reflow at 250°C and different thermal aging durations at 150°C for air-cooled samples have been studied. The effect of Bi is discussed based on the experimental results. It was found that the microhardness increases with increasing Bi addition to Sn-3.7Ag solder regardless of reflow or thermal aging process. Scanning electron microscopy images show the formation of Ag 3 Sn particles, Sn-rich phases, and precipitation of Bi-rich phases in different solders. The increase of microhardness with Bi addition is due to the solution strengthening and precipitation strengthening provided by Bi in the solder. The trend of decrease in microhardness with increasing duration of thermal aging was observed.

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“…e interfacial layer between the SAC0307-xZnO solders and the copper substrate was of Cu 6 Sn 5 intermetallic compound of varying thicknesses. …”

Section: Interfacial Layermentioning

confidence: 99%

“…e SAC0307 and other SAC solders nevertheless are plagued with low fatigue strength and creep resistance [5][6][7][8]. To mitigate, certain small particles were introduced into the solder to transform it into a composite material such that the movement of dislocations and the grain boundary slidings were hindered [6,7,9]. Importantly, with the advancement in the nanotechnology, many new nanoparticles have been synthesized and used as the dispersed phases in the solders (i.e., the nanocomposite solders) to enhance their mechanical properties [10].…”

Section: Introductionmentioning

confidence: 99%

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

Kanlayasiri

Meesathien

2018

Advances in Materials Science and Engineering

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is research investigates the effects of zinc oxide (ZnO) nanoparticles of varying concentrations 0.0, 0.25, 0.50, 0.75, and 1.0 wt.% on the melting temperatures, wettability, printability, slump, and interfacial microstructure of the ZnO-doped Sn-0.3Ag-0.7Cu lead-free solder pastes on the copper substrate. e results revealed that the introduction of the ZnO particles had no effect on the solidus and liquidus temperatures of the solders. e maximum wettability was achieved with 0.25 wt.% ZnO nanoparticles, while the printability was inversely correlated with the nano-ZnO concentrations. e findings also indicated that, at room temperature, the slumping and the nano-ZnO concentrations were positively correlated and that, under the 150°C thermal condition, the maximum slumping was achieved with 0.25 wt.% ZnO. e slumping mechanism of the SAC0307-xZnO solder pastes is also provided herein. Moreover, the experiments showed that Cu 6 Sn 5 was the single intermetallic compound present in the interfacial layer between the solders and the copper substrate, with the maximum intermetallic layer thickness realized at the 0.25 wt.% ZnO concentration.

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Composite solders

Cited by 48 publications

References 10 publications

Study on Cu particles-enhanced SnPb composite solder

Study on Cu particles-enhanced SnPb composite solder

Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

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