Complete 3D UV microfabrication technology on strongly sloping topography substrates using epoxy photoresist SU-8

Fabrication of multi-layer SU-8 microstructures

“…In this case, the 10 µm diameter posts exhibit a more cone-like shape on the second (upper) SU-8 2010 layer (∼5 µm diameter at the base) compared to the first SU-8 2010 layer (∼7 µm diameter at the base). This non-uniform exposure through the SU-8 layer could result from increased absorption of ultraviolet (UV) light with increasing thickness of the SU-8 layer, which, in turn, would result in intensity variations and associated differences in reflection characteristics from the underlying wafer surface during exposure [4,29,31,43]. In addition to maximizing contact quality between the photomask and the wafer, optimization of the exposure dosage (power and time) would also improve exposure uniformity.…”

Fabrication of metallic microstructure on curved substrate by optical soft lithography and copper electroplating

“…We expect that the fabrication of micro patterns on curved or circular substrates of smaller diameters can be achieved, based on the results of this work. As the poor adhesion between a copper substrate and SU-8 was already reported [20], Omnicoat was spincoated on the substrate to increase the adhesion between them. After Omnicoat was treated on the substrate, the SU-8 micro patterns were not peeled off and remained intact during the copper electroplating process.…”

“…The copper electroplating technique has been researched since the 19th century and provides an easy, fast, and cheap method to fabricate microstructures in the present day. Thus, it has mainly been used for the fabrication of interconnects [19] and thick metallic structures such as coils on a substrate [20]. In addition, the fabrication of microstructures by photolithography and electroplating is attracting attention in the development of MEMS devices such as sensors [21], actuators [22], and electric circuits [23].…”

Influence of Macro-Topography on Damage Tolerance and Fracture Toughness of 0.1 wt % Multi-Layer Graphene/Clay-Epoxy Nanocomposites

“…It has been shown that plasma etching of UHMPE produces micro-pittings on fiber surface and this spongy surface structure helps improve mechanical interlocking with the polymer matrix and causes a significant increase in interlaminar shear strength [ 32 , 33 , 34 , 35 ]. The topography can be controlled during synthesis such as using a combination of UV lithography and electro-deposition [ 36 ]. The topographical features may also be tailored by texturing the mold surface when the production route is the casting.…”