Complementary Metal Oxide Semiconductors Microelectromechanical Systems Integration

Saha, Hitartha; Chaudhuri, Chirasree Roy

doi:10.14429/dsj.59.1560

Cited by 6 publications

(4 citation statements)

References 60 publications

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“…1 In the current scenario, processors, an integral part of modern day computers, have been fabricated using semiconductor integrated circuits built with silicon using the technique of complementary metal oxide semiconductor (CMOS). 2 Miniaturization of silicon based transistors could lead to an increase in power consumption, heat dissipation and higher manufacturing expense. Through its use, nanotechnology looks to overcome the problems of current computing techniques with advantages such as miniaturization, parallelism, high processing ability, larger memory and speed.…”

Section: Introductionmentioning

confidence: 99%

Nanocomputing in medicine

Radhakrishnan

Smrithi

Hari

et al. 2018

MOJBM

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Abbreviations: CMOS, complementary metal oxide semiconductor; WHO, world health organization; LMWP, low molecular weight proteome AbstractThe need for protecting and maintaining the confidentiality of sensitive data has become of great importance and concern now a days due to the rapid growth of internet and fast information exchange technologies. In medicine it is of great concern to store the integrity of the personal medical data especially in the form of images. The emerging field of DNA based nanocomputing methods offers a relief to this problem which utilizes DNA sequences to hide data. The paper presents a review on the concept of DNA cryptography and DNA computing in general. It also presents an overview of various possible applications of DNA based nanocomputing.

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Section: Introductionmentioning

confidence: 99%

Nanocomputing in medicine

Radhakrishnan

Smrithi

Hari

et al. 2018

MOJBM

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“…Various microactuators and microsensors developed by the CMOS process are called CMOS-MEMS technique [ 19 , 20 , 21 , 22 ]. Usually, micro devices fabricated by the technique require a post-CMOS process to add the functional materials [ 23 , 24 ] and to release the suspended structures [ 25 , 26 , 27 ].…”

Section: Introductionmentioning

confidence: 99%

Fabrication and Characterization of a Micro Methanol Sensor Using the CMOS-MEMS Technique

Fong

Dai

2015

Sensors

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A methanol microsensor integrated with a micro heater manufactured using the complementary metal oxide semiconductor (CMOS)-microelectromechanical system (MEMS) technique was presented. The sensor has a capability of detecting low concentration methanol gas. Structure of the sensor is composed of interdigitated electrodes, a sensitive film and a heater. The heater located under the interdigitated electrodes is utilized to provide a working temperature to the sensitive film. The sensitive film prepared by the sol-gel method is tin dioxide doped cadmium sulfide, which is deposited on the interdigitated electrodes. To obtain the suspended structure and deposit the sensitive film, the sensor needs a post-CMOS process to etch the sacrificial silicon dioxide layer and silicon substrate. The methanol senor is a resistive type. A readout circuit converts the resistance variation of the sensor into the output voltage. The experimental results show that the methanol sensor has a sensitivity of 0.18 V/ppm.

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“…In their review, Jain and Goodson [1] note that thermal control is centrally important for a wide range of BioMEMS implementations. Ahmad and Hashsham [2] recently presented a survey of miniaturised thermal systems for genetic analysis while the review by Saha and Chaudhuri [3] provides a good overview of the state of CMOS/MEMS integrations. As noted by Ahmad and Hashsham, the verification of temperature uniformity is a challenge, often calling for calibration runs or the use of sensors that perturb the temperature distribution.…”

Section: Introductionmentioning

confidence: 99%

Robust thermal control for CMOS-based lab-on-chip systems

Martinez-Quijada

Hall

et al. 2015

J. Micromech. Microeng.

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The need for precise temperature control at small scales has provided a formidable challenge to the lab-on-chip community. It requires, at once, good thermal conductivity for high speed operation, good thermal isolation for low power consumption and the ability to have small (mm-scale) thermally independent regions on the same substrate. Most importantly, and, in addition to these conflicting requirements, there is a need to accurately measure the temperature of the active region without the need for device-to-device calibrations. We have developed and tested a design that enables thermal control of lab-on-chip devices atop silicon substrates in a way that could be integrated with the standard methods of mass-manufacture used in the electronics industry (i.e. CMOS). This is a significant step towards a single-chip lab-on-chip solution, one in which the microfluidics, high voltage electronics, optoelectronics, instrumentation electronics, and the world-chip interface are all integrated on a single substrate with multiple, independent, thermally-controlled regions based on active heating and passive cooling.

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Complementary Metal Oxide Semiconductors Microelectromechanical Systems Integration

Cited by 6 publications

References 60 publications

Nanocomputing in medicine

Nanocomputing in medicine

Fabrication and Characterization of a Micro Methanol Sensor Using the CMOS-MEMS Technique

Robust thermal control for CMOS-based lab-on-chip systems

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