2021
DOI: 10.1016/j.apsusc.2021.151015
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Complementary electrochemical ICP-MS flow cell and in-situ AFM study of the anodic desorption of molecular adhesion promotors

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Cited by 5 publications
(5 citation statements)
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“…Such observations validated an important correlation between oxide stability and faradaic efficiency of noble metals and alloys, broadly applicable to electrocatalysis applications. Dworschak et al [ 113 ] reported using ASEC analysis that hydrophobic thiol‐based self‐assembled monolayers on Au surface suppress the dissolution during oxygen evolution to some extent (Figure 11c).…”
Section: Dissolution and Fundamental Electrochemical Phenomenamentioning
confidence: 99%
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“…Such observations validated an important correlation between oxide stability and faradaic efficiency of noble metals and alloys, broadly applicable to electrocatalysis applications. Dworschak et al [ 113 ] reported using ASEC analysis that hydrophobic thiol‐based self‐assembled monolayers on Au surface suppress the dissolution during oxygen evolution to some extent (Figure 11c).…”
Section: Dissolution and Fundamental Electrochemical Phenomenamentioning
confidence: 99%
“…It is challenging to predict, avoid and rationalize the breakdown in most instances. Therefore, the ability of a material to regenerate the passive F I G U R E 1 1 (a) ASEC potentiodynamic polarization curves of noble metals, revealing dissolution during anodic oxygen evolution and cathodic reduction in acid solution, (b) correlation between Tafel slope and dissolution rate of noble metals at j ext = 5 mA/cm 2 during oxygen evolution (Cherevko et al [18] ), and (c) effect of thio-based seft-assembled monolayers (SAMs) on anodic dissolution kinetics of Au (Dworschak et al [113] ). Reproduced with permission from Wiley and Elsevier.…”
Section: Repassivationmentioning
confidence: 99%
“…The attack over metallic materials by fungus is explained by the fact that from fungus metabolism a lot of organic acids, like tartric, citric and oxalic acid, solubilize the metals [12][13][14][15][16][17][18][19]. The corrosive action of fungus over metal material is accentuated in warm and humid areas where damages are very important [20][21][22][23][24]. The species of fungus which attack metallic materials and plastic materials are: Trichoderma, Neurospora, Fusarium sp., Aspergillus sp., Penicillium sp., Chaetomium and Sterigmatocystis [21][22][23][24].…”
Section: Introductionmentioning
confidence: 99%
“…The corrosive action of fungus over metal material is accentuated in warm and humid areas where damages are very important [20][21][22][23][24]. The species of fungus which attack metallic materials and plastic materials are: Trichoderma, Neurospora, Fusarium sp., Aspergillus sp., Penicillium sp., Chaetomium and Sterigmatocystis [21][22][23][24].…”
Section: Introductionmentioning
confidence: 99%
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