2013 IEEE Radiation Effects Data Workshop (REDW) 2013
DOI: 10.1109/redw.2013.6658191
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Compendium of TID, Neutron, Proton and Heavy Ion Testing of Satellite Electronics for Los Alamos National Laboratory

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Cited by 10 publications
(5 citation statements)
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“…An experimental evaluation of the ECC efficiency is presented in the following section. These results are very reasonable given the small feature size, especially since many other microprocessor components have higher MCU/MBU rates [23].…”
Section: Fig 4 Shows the Bit Cross-sections For The Different Test Csupporting
confidence: 52%
“…An experimental evaluation of the ECC efficiency is presented in the following section. These results are very reasonable given the small feature size, especially since many other microprocessor components have higher MCU/MBU rates [23].…”
Section: Fig 4 Shows the Bit Cross-sections For The Different Test Csupporting
confidence: 52%
“…The results of these tests showed that most of the components are sensitive to SEUs, fewer are sensitive to SETs, while the flash based MSP430 and feRAM based MSP430 were sensitive to high current and SEL [3]. Tairbank et al [4] tested two microcontrollers LPC2148 produced by NXP Semiconductors and STM32F417IGH6 manufactured by STMicro. The TID test results showed that the flash of the LPC2148 can no longer be written after 20-25 krad (Si), most parts are non-functional above 55 krads (Si), some latchup or high current events in neutron, and destructive latch in Xenon LET =58.78 Mev-cm2/mg where the LET stands for "Linear Energy Transfer" which characterizes the energy lost along its linear path in silicon.…”
Section: Related Workmentioning
confidence: 99%
“…While, STM32F417IGH6 showed two SEUs events in neutron irradiation. The test done on evaluation board where SEUs observed in proton and non-destructive latch-ups observed with all ions> LET=2.19 Mev-cm2/mg [4]. Hirofuni [5] used COTS components for development of cub-satellites.…”
Section: Related Workmentioning
confidence: 99%
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“…Recent publications have studied more modern microprocessors [9], [10] with reduced feature sizes and multiple processing cores. The authors have also previously published results for the NXP LPC2148FBD64 and the ST Microelectronics STM32F417IG [11]. Both the NXP LPC2148FBD64 and the ST Microelectronics STM32F417IG exhibited problems with high-current events and single-event latchup, so testing of other microprocessors was completed in 2013 and 2014.…”
Section: Introductionmentioning
confidence: 99%