2016
DOI: 10.1016/j.tsf.2016.03.004
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Comparison of ZnO:B and ZnO:Al layers for Cu(In,Ga)Se2 submodules

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Cited by 19 publications
(20 citation statements)
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“…O 2 /(Ar + O 2 ) flow ratios were 1% and 0.4% during ZnO and ZnO:Al deposition, respectively. Layers of 1.8‐μm‐thick ZnO:B were deposited at 160°C and 170°C via MOCVD using diethylzinc, water, and diborane with flow rates of 100, 200, and 0.2 μmol minute −1 , respectively . A 50‐nm‐thick a ‐IGZO layer was deposited with no intentional substrate heating via rf magnetron sputtering deposition using an In‐Ga‐Zn‐O (In:Zn:Ga = 1:1:1) ceramic target with an O 2 /(Ar + O 2 ) flow ratio of 0.08%.…”
Section: Methodsmentioning
confidence: 99%
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“…O 2 /(Ar + O 2 ) flow ratios were 1% and 0.4% during ZnO and ZnO:Al deposition, respectively. Layers of 1.8‐μm‐thick ZnO:B were deposited at 160°C and 170°C via MOCVD using diethylzinc, water, and diborane with flow rates of 100, 200, and 0.2 μmol minute −1 , respectively . A 50‐nm‐thick a ‐IGZO layer was deposited with no intentional substrate heating via rf magnetron sputtering deposition using an In‐Ga‐Zn‐O (In:Zn:Ga = 1:1:1) ceramic target with an O 2 /(Ar + O 2 ) flow ratio of 0.08%.…”
Section: Methodsmentioning
confidence: 99%
“…The O 2 /(Ar + O 2 ) flow ratios were 24% for 50 and 70‐nm‐thick films and 30% for 150‐nm‐thick films. The electrical properties of the TOS and TCO films are described elsewhere . The sheet resistance of ZnO:Al, ZnO:B (160°C), ZnO:B (170°C), a ‐In 2 O 3 :H (50 nm), a ‐In 2 O 3 :H (70 nm), and a ‐In 2 O 3 :H (150 nm) grown on SLG was 39, 19, 15, 69, 51, and 27 Ω sq −1 , respectively.…”
Section: Methodsmentioning
confidence: 99%
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“…can be compared. It was shown before, that by exchanging ZnO:Al with a ZnO:B TCO, the short circuit current density J SC can be increased, 9 while for In 2 O 3 :H an improved J SC and V oc was observed. 10 However, these studies were conducted on CIGSe solar cells, which were not subjected to a KF-PDT step during processing.…”
Section: Introductionmentioning
confidence: 90%
“…Three TCOs are investigated here: (1) sputtered i‐ZnO/ZnO:Al (reference), (2) chemical vapor deposited (CVD) ZnO:B, and (3) sputtered In 2 O 3 :H. In this way, a change in deposition method as well as a change in material system can be compared. It was shown before, that by exchanging ZnO:Al with a ZnO:B TCO, the short circuit current density J SC can be increased, while for In 2 O 3 :H an improved J SC and V oc was observed . However, these studies were conducted on CIGSe solar cells, which were not subjected to a KF‐PDT step during processing.…”
Section: Introductionmentioning
confidence: 99%