Comparison of thermo-mechanical behavior of lead-free copper and tin–lead column grid array packages

Park, S.B.; Joshi, R.

doi:10.1016/j.microrel.2007.12.008

Cited by 15 publications

(9 citation statements)

References 2 publications

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“…9 In lead-free applications the columns are either 90Pb-10Sn alloy wrapped with copper or thin (250 lm) Cu columns. 7,[10][11][12] Unfortunately, the thin columns are difficult to process, since they bend easily and require special tooling. 13 Another approach to relieving the high stress level in the joints of LTCC/PWB assemblies is to use a plastic-core solder ball (PCSB) in the solder joint.…”

Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Nousiainen

Kangasvieri

Rautioaho

et al. 2009

Journal of Elec Materi

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The thermal fatigue endurance of two lead-free solder/plastic-core solder ball (PCSB) composite joint structures in low-temperature co-fired ceramic (LTCC) modules was investigated using a thermal cycling test over a temperature range of À55°C to 150°C. The investigated solder alloys were Sn-7In-4.1Ag-0.5Cu (SAC-In) and 95.5Sn-4Ag-0.5Cu (SAC). Three failure mechanisms were observed in the test joints. Transgranular (fatigue) cracking mixed with minor intergranular cracking was the dominant failure mechanism at the outer edge of the joints in both test assemblies, whereas separation of the solder/intermetallic compound (IMC) interface and creep cracking occurred in the other parts of the test joints. The propagation rate of the transgranular crack was lower in the SAC-In joints compared with in the SAC joints. Furthermore, the SAC solder seemed to be more prone to separation of the solder/IMC interface, and more severe intergranular (creep) cracking occurred in it compared with in the SAC-In solder. In the thermal cycling test conditions, the better thermal fatigue endurance of the SAC-In solder composite joints resulted in a 75% higher characteristic lifetime compared with the SAC composite joints.

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Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Nousiainen

Kangasvieri

Rautioaho

et al. 2009

Journal of Elec Materi

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“…They have tried to find out the main factors to the joints' reliability [2][3][4][5], and to explore the efficient ways to improve the reliability [6]. Also some researchers have reported the failure mechanisms of solder joints under mechanical vibration or thermal cycling [7][8][9][10], etc. However, the practical application conditions of electronics are more complex and the electronics will undergo more than one or two types of loading at the same time.…”

Section: Introductionmentioning

confidence: 99%

Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints

Ding¹,

Tian

Wang³

et al. 2015

Microelectronics Reliability

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“…The ceramic column grid array (CCGA) package developed by IBM is one of the best candidates for housing these kinds of chips [1][2][3].…”

Section: Introductionmentioning

confidence: 99%

“…The CuCGA interconnect consists of an annealed and tin-plated copper column in place of a high-Pb (Sn/90Pb) solder column and Pb-free solder fillets in place of eutectic solder fillets [1,3], thereinto, the solder fillet in one PCB side is the SnAgCu eutectic solder, and the solder fillet in one ceramic substrate side is the higher melting Sn/18Ag solder to maintain the packaging hierarchy. Like the CCGA, the CuCGA offers a high reliability packaging solution.…”

Section: Introductionmentioning

confidence: 99%

“…Like the CCGA, the CuCGA offers a high reliability packaging solution. The thermal cycling test data from [1,[3][4][5] In the CuCGA, crack initiates in the solder fillet on the ceramic side near the column and solder interface, the crack propagates along the boundary of the copper column and solder interface generally. The nature of this failure is unlike that observed in tin-lead columns CCGA where the failure occurs at the tin-lead column near the top of the fillet and through the column thickness [4,6].…”

Section: Introductionmentioning

confidence: 99%

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An idealized shape of CuCGA solder joint and its load-carrying advantage

Zhongliang

Xirui

Sun

2013

2013 14th International Conference on Electronic Packaging Technology

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Solder joint geometry feature is important for packaging miniaturization design. To improve the thermomechanical reliability of lead-free packaging, a copper column interconnect with idealized solder joint shape, composed of a double-funnel shaped copper column and two lead-free solder fillets at both ends of the column, was designed to replace the high-Pb solder column interconnect in ceramic column grid array (CCGA) and the conventional copper column interconnect in ceramic copper column grid array (CuCGA) package. Mechanical behaviors under shear loading and bend loading were studied using finite element method FEM . Results indicate that the peak plastic strain in the designed CuCGA interconnect decreases slightly compared with the conventional CuCGA interconnect, however the peak plastic strain in its solder fillets decreases significantly due to stress concentration locations transfer from the interface of solder and copper column to the inside of funnel-shaped copper column. Therefore the lower strength solder fillets were protected, a higher load-carrying ability for the CuCGA package could be expected.

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Comparison of thermo-mechanical behavior of lead-free copper and tin–lead column grid array packages

Cited by 15 publications

References 2 publications

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints

An idealized shape of CuCGA solder joint and its load-carrying advantage

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