“…The resistive switching characteristics in a metalāinsulatorāmetal structure have been shown keen attention for next-generation resistive random access memory (RRAM) to change the conventional nonvolatile memory in future. Considering all emerging nonvolatile memories, intensive research and development of RRAM have been triggered owing to its simple structure, small size feature, low power consumption, ultrafast switching speed, and impressive retention capability than those of others. , Several research groups have chosen various materials that possess resistive switching characteristics, such as HfO x , , TaO x , , SiO 2 , , Al 2 O 3 , etc . Among them, TaO x is considered as one of the most important materials owing to its compatibility to complementary metal-oxide-semiconductor application, higher thermal stability up to 1000 Ā°C, high dielectric constant ( k ā¼ 16ā60), moderate Gibbs free energy (ā760.5 kJ/mol at 300 K), metastable phase of TaO 2 , and stable phase of Ta 2 O 5 . ,,ā Recently, molybdenum disulfide (MoS 2 ) as inorganic transition-metal dichalcogenide has drawn much attention in the resistive switching memory application due to some of its distinctive features, like variable band gap semiconductor ( E g ā¼ 1.23 eV for indirect band gap with bulk MoS 2 and E g ā¼ 1.8 eV for direct band gap with monolayer MoS 2 ), high electron affinity (Ļ MoS 2 ā¼ 4.3 eV), a wide range of the dielectric constant ( k ā¼ 4ā17), composition of covalently bonded SāMoāS structures, and chemical inertness. ā Recently, the RRAM device including MoS 2 switching material (SM) has been reported by a few groups. ā Bessonov et al have reported the bipolar resistive switching (BRS) by using Ag/MoO x /MoS 2 /Ag structure at a current compliance (CC) of 5 mA .…”