Comparison of multichip module technologies for the electronic packaging-of high clock digital signal processors

Gilbert, Barry K.; Schwab, Daniel; Randall, B.; Thompson, R.L.; Hakes, R.J.; Mielke, L.O.; Schaefer, T.M.; Zabinski, P.J.; Walters, W.L.

doi:10.1109/wptmt.1994.763516

Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies

DOI: 10.1109/wptmt.1994.763516

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Comparison of multichip module technologies for the electronic packaging-of high clock digital signal processors

Barry K. Gilbert

Daniel Schwab²,

B. Randall³

et al.

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Comparison of multichip module technologies for the electronic packaging-of high clock digital signal processors

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