Comparison of mechanical, electrical and thermal properties in graphene oxide and reduced graphene oxide filled epoxy nanocomposite adhesives

Aradhana, Ruchi; Mohanty, Smita; Nayak, Sanjay K.

doi:10.1016/j.polymer.2018.03.005

Cited by 174 publications

(75 citation statements)

References 41 publications

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“…Linear viscoelasticity: variation of the dynamic storage versus frequencies: reproducibility for the PMMA/Si-wd compositesThe weighted relaxation spectra H() versus relaxation time  of the neat PMMA and PMMA/Si composites at 230°C (Figure 5) was obtained from Eqs. (1) and(2). As expected, PMMA depicts a single peak at 0.12 s, which is its characteristic relaxation time.…”

supporting

confidence: 78%

“…The use of nanoparticles as reinforcements for polymer matrices is relatively common due to their ability to impart strong improvements of performances at very low volume fractions in comparison to micrometric particles [1]. Nanocomposites find applications in various fields as their enhanced properties can be mechanical, electrical, optical… [2]. Particularly; nanoparticles are widely used to provide mechanical reinforcement to polymer matrices.…”

Section: Introductionmentioning

confidence: 99%

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Dispersion control of raw and modified silica particles in PMMA. Impact on mechanical properties, from experiments to modelling

Siot¹,

Léger²,

Longuet³

et al. 2019

Composites Part B: Engineering

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Structure and properties of PMMA/silica composites were characterized by various methods including SEM, TGA, rheology, microscopic level evaluation of nanoreinforcement effect on properties. Static modulus and yield strength of PMMA are enhanced with silica incorporation regardless of their dispersion or functionalization. However, composites ultimate properties are strongly affected by fillers characteristics. As expected, better performances are associated to well-dispersed and functionalized silica. A finite element modelling with interface debonding through cohesive model and interfacial area is introduced to reproduce the sensibility of tensile test response to fillers surface functionalization. Experimental results confirmed this modelling: at constant low weight rate, ultimate composites properties are mostly affected by any microstructural changes. An analysis of local stress confirms the premature breakage of composite with pristine silica. Finally, by considering the expected properties, functionalization of silica is not always a necessity. Instead of particle functionalization, a dispersion protocol could be advantageously used to reach interesting composite properties.

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supporting

confidence: 78%

Section: Introductionmentioning

confidence: 99%

Dispersion control of raw and modified silica particles in PMMA. Impact on mechanical properties, from experiments to modelling

Siot¹,

Léger²,

Longuet³

et al. 2019

Composites Part B: Engineering

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“…With the incorporation of 0.25 wt.% of GO, a slight increase of approximately 10% relative to the pure EP specimens was observed. The study by Aradhana et al [41] reported an increase of more than 200% in thermal conductivity with 0.5 wt.% of GO within the EP. An increase of 20% and 90% in thermal conductivity was obtained by Kim et al [42] for 1 wt.% and 3 wt.%, respectively.…”

Section: Mechanical Propertiesmentioning

confidence: 95%

Mechanical, Thermal, and Acoustic Properties of Aluminum Foams Impregnated with Epoxy/Graphene Oxide Nanocomposites

Pinto

Marques

Vesenjak

et al. 2019

Metals

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Hybrid structures with epoxy embedded in open-cell aluminum foam were developed by combining open-cell aluminum foam specimens with unreinforced and reinforced epoxy resin using graphene oxide. These new hybrid structures were fabricated by infiltrating an open-cell aluminum foam specimen with pure epoxy or mixtures of epoxy and graphene oxide, completely filling the pores. The effects of graphene oxide on the mechanical, thermal, and acoustic performance of epoxy/graphene oxide-based nanocomposites are reported. Mechanical compression analysis was conducted through quasi-static uniaxial compression tests at two loading rates (0.1 mm/s and 1 mm/s). Results show that the thermal stability and the sound absorption coefficient of the hybrid structures were improved by the incorporation of the graphene oxide within the epoxy matrix. However, the incorporation of the graphene oxide into the epoxy matrix can create voids inside the epoxy resin, leading to a decrease of the compressive strength of the hybrid structures, thus no significant increase in the energy absorption capability was observed.

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“…In another work of Tao Huang, RGO shows better TC value inside epoxy [12,13]. Also, Aradhana et al [36] explained that the improvement in TC values up to the certain extent of GO and RGO filler loading and TC value decreases due to agglomeration of filler. APTES-modified h-BN epoxy composite shows better results than native h-BN epoxy composite at each weight fraction described in Fig.…”

Section: Ftir Analysismentioning

confidence: 96%

Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application

Nayak

Mohanty

2019

SN Appl. Sci.

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In recent years, significant interest has been focused on fabricating epoxy-based hybrid composite with a high thermal conductivity at optimum filler loading. As epoxy usually has a low thermal conductivity, the high intrinsic thermal conducting fillers such as h-BN, GO and RGO are incorporated. In this research, we report the epoxy-based hybrid composites with an enhanced thermal conductivity through silane-modified h-BN (mh-BN) with RGO. The sample containing 44.5 wt% (40 wt% mh-BN and 4.5 wt% RGO) hybrid filler exhibited the highest thermal conductivity (1.416 W/mK) which was 7 times that of pristine epoxy (0.21 W/mK). The thermal conductivities of RGO with unmodified h-BN (0.789 W/mK), GO with mh-BN (0.769 W/mK) and GO with unmodified h-BN (0.713) at 44.5 wt% loading are also reported. Comparison property studies of these above-mentioned four hybrid composites are described by lap shear strength, flexural strength, impact strength and thermogravimetric analysis. The fabricated hybrid composites exhibit outstanding performance in lap shear strength, thermal stability, and slightly reduced impact and flexural strength, which makes it as relevant for electronics packaging application such semiconductors, integrated circuit packaging, optoelectronics and also can attest potentiality in structural energy storage application. The atomic force microscopy and scanning electron microscopy verified the surface roughness and morphology of two optimized compositions, i.e., mh-BN with RGO and h-BN with RGO with the epoxy matrix. Also, Maxwell, Hashin-Shtrikmann and series equations are used to verify the obtained experimental value.

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Comparison of mechanical, electrical and thermal properties in graphene oxide and reduced graphene oxide filled epoxy nanocomposite adhesives

Cited by 174 publications

References 41 publications

Dispersion control of raw and modified silica particles in PMMA. Impact on mechanical properties, from experiments to modelling

Dispersion control of raw and modified silica particles in PMMA. Impact on mechanical properties, from experiments to modelling

Mechanical, Thermal, and Acoustic Properties of Aluminum Foams Impregnated with Epoxy/Graphene Oxide Nanocomposites

Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application

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