Comparison of current practices for a combined management of printed circuit boards from different waste streams

Rosa, Paolo; Terzi, Sergio

doi:10.1016/j.jclepro.2016.07.089

Cited by 23 publications

(10 citation statements)

References 80 publications

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“…The difference depends mainly upon four aspects: (i) illegal flows; (ii) no attention of citizens towards environmental problems; (iii) absence of regulations; and (iv) inadequate number (or location) of collection centres (Cucchiella et al, 2016a). Furthermore, both current recovery performance and recyclability measurement procedures are yet insufficient to contain the annual increase of generated waste (Tao et al, 2017;Zhang et al, 2016b) and so the calculation of e-waste reused and recycled is extremely relevant (Rosa and Terzi, 2016;.…”

Section: Literature Reviewmentioning

confidence: 99%

Modelling the correlations of e-waste quantity with economic increase

Awasthi

Cucchiella

D’Adamo

et al. 2018

Science of The Total Environment

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123

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Section: Literature Reviewmentioning

confidence: 99%

Modelling the correlations of e-waste quantity with economic increase

Awasthi

Cucchiella

D’Adamo

et al. 2018

Science of The Total Environment

Self Cite

123

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“…This issue pushed the European Union (EU) and other intranational institutions to define even more restrictive guidelines to be adopted by companies in terms of product and process sustainability. During the last few decades, these guidelines have been translated in the Circular Economy (CE) paradigm, or a synergistic view between ecological and economic systems [1,2]. Second, the intrinsic complexity of current industrial markets (e.g., shorter product lifecycles and higher mass customization) is even more dependent on automated and digital solutions supporting companies for meeting with customer's needs.…”

Section: Introductionmentioning

confidence: 99%

Integrating Virtual Reality and Digital Twin in Circular Economy Practices: A Laboratory Application Case

et al. 2020

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The increasing awareness of customers toward climate change effects, the high demand instability affecting several industrial sectors, and the fast automation and digitalization of production systems are forcing companies to re-think their business strategies and models in view of both the Circular Economy (CE) and Industry 4.0 (I4.0) paradigms. Some studies have already assessed the relations between CE and I4.0, their benefits, and barriers. However, a practical demonstration of their potential impact in real contexts is still lacking. The aim of this paper is to present a laboratory application case showing how I4.0-based technologies can support CE practices by virtually testing a waste from electrical and electronic equipment (WEEE) disassembly plant configuration through a set of dedicated simulation tools. Our results highlight that service-oriented, event-driven processing and information models can support the integration of smart and digital solutions in current CE practices at the factory level.

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“…The results gain significance once this apparatus might be used to process PCBs derived from other was- te streams, such as scrap automotive PCBs - Rosa and Terzi (2016) point out that such PCBs are very similar to PCBs from WEEE and therefore can be treated by the same processes.…”

Section: Resultsmentioning

confidence: 90%

Disassembly of waste printed circuit boards using air heating and centrifugal force

Rubin

Castro

Brandão

2019

REGET

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Waste electrical and electronic equipment is a significant source of material that can contribute to reduce environmental impacts associated to extraction and discard stages; therefore, it is necessary to develop efficient recycling processes for components such as Printed Circuit Boards (PCBs). Current methods for PCB recycling may be optimized by previous disassembly of such components. In the work reported here, an especially designed and manufactured centrifuge was employed to disassemble PCBs from power supplies (PS-PCBs) and memory chips (ME-PCBs) of personal computers (PCs), through combination of hot air flow and centrifugal force. The results showed that the device was capable of separating tin solder, electronic components (EC) and PCB substrate, as long as hazardous components and plastic parts are previously removed. A scanning electron microscope (SEM) with combined energy dispersive X-ray (EDX) analyzer showed that the recovered solder had under 3%wt of contamination; therefore, it can be employed in the production of new soldering material, replacing the more commonly used solder dross. EC recovery rates were up to 94%wt for PS-PCBs and 32%wt for ME-PCBs, and once components such as inductors were not visibly damaged in the process, possibilities of reusing recovered components may be further investigated.

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Comparison of current practices for a combined management of printed circuit boards from different waste streams

Cited by 23 publications

References 80 publications

Modelling the correlations of e-waste quantity with economic increase

Modelling the correlations of e-waste quantity with economic increase

Integrating Virtual Reality and Digital Twin in Circular Economy Practices: A Laboratory Application Case

Disassembly of waste printed circuit boards using air heating and centrifugal force

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