Comparison of amperometric biosensors fabricated by palladium sputtering, palladium electrodeposition and Nafion/carbon nanotube casting on screen-printed carbon electrodes

Clinical Evaluation of Bionime Rightest GM310 Biosensors with a Simplified Electrode Fabrication for Alternative-Site Blood Glucose Tests

“…Commercially available meters that apply the SPCE technique have CVs in the range of 3%-6% (21-23 ). The imprecision of glucose meter measurements has been attributed to inconsistency in the electrochemical response area (11 ). In the present study, efficient control of the electrochemical area seemed to effectively improve the imprecision.…”

“…In the present study, efficient control of the electrochemical area seemed to effectively improve the imprecision. Additionally, gold electrodeposition during electrode manufacturing has better precision than the sputtering process because of the former's electrochemical reproducibility (11 ). We suggest that the superior precision of the GM310 may be attributed to its simplified fabrication technique (24 ).…”

“…Major problems can still occur with SPCE techniques, however, as when polymers in the ink increase electrontransfer resistance, for example. In addition, inconsistency of the electrochemical area of SPCEs may produce imprecise measurements of blood glucose concentrations (4,11 ).…”

“…Therefore, such processes as electroplating of copper (13 ) and sputtering of palladium and gold (11,14 ) have frequently been used to modify electrodes and thereby accelerate electron-transfer kinetics and reduce the potential required. Fabrication processes applied to most SPCE-based devices are extremely complex, however, and thus a simple process is required.…”

Fundamentals of Microfluidics Devices

“…The scanning of an ion beam across the substrate is similar to scanning electron microscopy, and the removal of material occurs in a manner similar to removal of material from the metal target during the sputtering process. [143][144][145] Focused ion beam micromachining and focused electron beam micromachining should not be confused with e-beam lithography (Section 1.4.1). In the case of focused ion beam and focused electron beam micromachining, the use of a photoresist and the additional process steps of development and stripping are not required.…”