2007
DOI: 10.1117/12.734739
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Comparing the low-temperature performance of megapixel NIR InGaAs and HgCdTe imager arrays

Abstract: We compare a more complete characterization of the low temperature performance of a nominal 1.7um cutoff wavelength 1kx1k InGaAs (lattice-matched to an InP substrate) photodiode array against similar, 2kx2k HgCdTe imagers to assess the suitability of InGaAs FPA technology for scientific imaging applications. The data we present indicate that the low temperature performance of existing InGaAs detector technology is well behaved and comparable to those obtained for state-of-the-art HgCdTe imagers for many space … Show more

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Cited by 5 publications
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“…However, due to the limitation of Si's own forbidden band width (1.12 eV) [3] , its spectral response is cut off near 1100 nm, which results in conventional Si-based photodetectors unable to respond to photons in the infrared band. Some new semiconductor materials such as InGaAs/HgCdTe [4] and ferroelectric materials [5] such as barium strontium titanate using pyroelectric effect have a wider response spectrum, however, these kinds of materials not only have difficulty in raw material preparation, but the device design and fabrication technology are both immature, which led to their high fabrication cost unable to fully replace the current Si-based optoelectronic sensor devices. At the end of the 20th century, E. Mazur [6] used femtosecond lasers to etch spike-like micro-and nano-structures (black silicon) on the surface of silicon wafers in SF6 atmosphere.…”
Section: Introductionmentioning
confidence: 99%
“…However, due to the limitation of Si's own forbidden band width (1.12 eV) [3] , its spectral response is cut off near 1100 nm, which results in conventional Si-based photodetectors unable to respond to photons in the infrared band. Some new semiconductor materials such as InGaAs/HgCdTe [4] and ferroelectric materials [5] such as barium strontium titanate using pyroelectric effect have a wider response spectrum, however, these kinds of materials not only have difficulty in raw material preparation, but the device design and fabrication technology are both immature, which led to their high fabrication cost unable to fully replace the current Si-based optoelectronic sensor devices. At the end of the 20th century, E. Mazur [6] used femtosecond lasers to etch spike-like micro-and nano-structures (black silicon) on the surface of silicon wafers in SF6 atmosphere.…”
Section: Introductionmentioning
confidence: 99%