Comparative Study of Cu Films Prepared by DC, High-Power Pulsed and Burst Magnetron Sputtering

Solovyev, A. A.; Oskirko, V. O.; Semenov, V. A.; Оскомов, К. В.; Работкин, С. В.

doi:10.1007/s11664-016-4582-6

Cited by 20 publications

(3 citation statements)

References 29 publications

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“…High-ionizationrate plasma bombards the substrate under substrate bias, resulting in a thin film with good density and high adhesion between the film and substrate [5,12,13]. At the same time, HiPIMS has the characteristics of high peak power, low pulse frequency, and low duty cycle, which reduces the average power and avoids the phenomenon of target material melting due to high power and insufficient water cooling ability [14,15]. The characteristics of HiPIMS high-density plasma have aroused great interest in related industries.…”

Section: Introductionmentioning

confidence: 99%

Influence of HiPIMS Pulse Widths on the Structure and Properties of Copper Films

Liu,

Bai,

Ren

et al. 2024

Materials

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High-power pulse magnetron sputtering is a new type of magnetron sputtering technology that has advantages such as high peak power density and a high ionization rate compared to DC magnetron sputtering. In this paper, we report the effects of different pulse widths on the current waveform and plasma spectrum of target material sputtering, as well as the structure and properties of Cu films prepared under the same sputtering voltage and duty cycle. Extending the pulse width can make the sputtering enter the self-sputtering (SS) stage and improve the ion quantity of sputtered particles. The Cu film prepared by HiPIMS with long pulse width has higher bond strength and lower electrical resistivity compared to the Cu film prepared by short pulse width. In terms of microstructure, the Cu film prepared by HiPIMS with the long pulse width has a larger grain size and lower micro-surface roughness. When the pulse width is bigger than 200 μs, the microstructure of the Cu film changes from granular to branched. This transformation reduces the interface on the Cu film, further reducing the resistivity of the Cu film. Compared to short pulses, long pulse width HiPIMS can obtain higher quality Cu films. This result provides a new process approach for preparing high-quality Cu films using HiPIMS technology.

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Section: Introductionmentioning

confidence: 99%

Influence of HiPIMS Pulse Widths on the Structure and Properties of Copper Films

Liu,

Bai,

Ren

et al. 2024

Materials

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“…Due to suppressed back-attraction effect [32] and sputtering mechanism being still dominated by argon bombardment [33], the deposition rate is increased [26,31,34,35]. Multiple names were used for this HiPIMS operation: burst HiPIMS [36,37], chopped HiPIMS [26,27,38] or multi-pulse HiPIMS (m-HiPIMS) [28,[39][40][41][42][43][44][45][46]. This method is referred to as m-HiPIMS in this paper.…”

Section: Introductionmentioning

confidence: 99%

Dynamics of sputtered particles in multipulse HiPIMS discharge

Hnilica¹,

Klein²,

Vašina³

et al. 2023

Plasma Sources Sci. Technol.

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The behavior of the ground state neutral and singly ionized atoms is studied in multipulse high power impulse magnetron sputtering processes. The time-resolved two-dimensional laser induced ﬂuorescence was used for imaging the discharge volume (density mapping) during the plasma-on and plasma-oﬀ time phases. The role of the number of micropulses and delay time between the micropulses in the pulse package is analyzed and discussed systematically. In addition, the propagation of the sputtered particles from the target is investigated.

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“…There are various methods for coating copper on fabrics such as electroless plating [7], plasma sputtering [8], and so on. Magnetron sputtering is an attractive technique of largescale fabrication of high-quality thin films due to its environmentally friendly, low operating temperature, and good reproducibility [9]. In addition, magnetron sputtering enables deposition of uniform copper films on various substrates [10–13].…”

Section: Introductionmentioning

confidence: 99%

Preparation and characterization of copper-coated polyester fabric pretreated with laser by magnetron sputtering

Peng

Guo

Lan

et al. 2017

Journal of Industrial Textiles

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Laser treatment is a high-efficiency coating process with many advantages of stable performance, convenient operation and environmental friendly. In this study, an efficient method for the pretreatment of polyester fabric, based on exposure to the output from a CO2 laser, is investigated. Polyester fabrics were treated by laser and then copper films were coated on the surface of treated polyester fabrics by magnetron sputtering method. Copper-coated polyester fabrics were characterized by XRD and SEM. Contact angle, heat generation and electrical conductivity of copper coated polyester fabric were tested. The electrical conductivity, UPF value and contact angle of copper-coated polyester fabric with pretreatment of 6.5 W lasers are 0.239 Ω/sq, 147.4, and 128.5°, respectively. The temperature of copper-coated fabric can be kept at 25.8℃ using only 5 V. The results suggest that the copper-coated polyester fabric with pretreatment of laser has excellent electrical conductive property, hydrophobicity, UV blocking, and heat generation properties. The adhesion strength between copper coating and fibers is improved after laser treatment. Laser can be potentially used in pretreatment of fabrics before coating in the future.

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Comparative Study of Cu Films Prepared by DC, High-Power Pulsed and Burst Magnetron Sputtering

Cited by 20 publications

References 29 publications

Influence of HiPIMS Pulse Widths on the Structure and Properties of Copper Films

Influence of HiPIMS Pulse Widths on the Structure and Properties of Copper Films

Dynamics of sputtered particles in multipulse HiPIMS discharge

Preparation and characterization of copper-coated polyester fabric pretreated with laser by magnetron sputtering

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