2020
DOI: 10.1109/temc.2019.2903567
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Comparative Analysis of the Crosstalk Effects in Multilayer Graphene Nanoribbon and MWCNT Interconnects in Sub-10 nm Technologies

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Cited by 36 publications
(31 citation statements)
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“…Hence, power dissipation is more severe in the case of the resistive driver in comparison to a CNTFET driver. Moreover, the result of power dissipation obtained for the proposed MCB interconnect is correlated with the simulation result obtained by the other authors in [32, 33] in Table 5. It is observed that the proposed model outperformed by 99.55 and 44.37% in terms of power dissipation as compared to the other research work given in [32, 33], respectively.…”
Section: Performance Analysissupporting
confidence: 83%
“…Hence, power dissipation is more severe in the case of the resistive driver in comparison to a CNTFET driver. Moreover, the result of power dissipation obtained for the proposed MCB interconnect is correlated with the simulation result obtained by the other authors in [32, 33] in Table 5. It is observed that the proposed model outperformed by 99.55 and 44.37% in terms of power dissipation as compared to the other research work given in [32, 33], respectively.…”
Section: Performance Analysissupporting
confidence: 83%
“…where the p.u.l. scattering resistance (r s,MLGNR ) of a single layer of GNR [12,18] is calculated using Equation (6b), as…”
Section: Resistance Modelmentioning
confidence: 99%
“…The Ce is usually due to electric field coupling between bottommost layer and the ground plane. The Cq and Ce capacitances for MLGNR interconnects [28][29] is estimated using (13) and (14) as…”
Section: Capacitance Modelmentioning
confidence: 99%