Comparative analysis of reliability between dual-row and conventional QFN packages

Xia, Guofeng; Qin, Fei; Zhu, Wenhui; Ma, Xin; Gao, Cha

doi:10.1109/icept-hdp.2012.6474693

Cited by 7 publications

(5 citation statements)

References 6 publications

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“…Fu [10] directly affixed carbon nanotubes as micro-scale heat sinks onto chips, significantly improving chip heat dissipation. Xia [11] employed Flotherm computational fluid dynamics (CFD) software to predict the thermal performance of dual-row and conventional QFN packages. Bairi [12] affirmed the positive effect of wire bonding technology on temperature regulation in QFN16b packages.…”

Section: Introductionmentioning

confidence: 99%

Effect of Thermal via Design on Heat Dissipation of High-Lead QFN Packages Mounted on PCB

Yuan,

Ding,

Zhang

2023

Applied Sciences

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The quad flat no-lead package (QFN) is widely used in integrated circuits due to its advantages in performance and cost. With the increasing power of electronic products, effective heat dissipation from QFN packages has become crucial to prevent product damage. The focus of this study is to investigate the thermal performance of QFN packages soldered onto printed circuit boards (PCB) by finite element analysis (FEA). Conventional QFN, dual-row QFN, and high-lead QFN packages were modeled and compared by ANSYSY software. The effect of thermal via design (the distance, number, distribution, diameter, and thickness of thermal vias) on the QFN package was investigated. The study revealed that the high-lead QFN package consistently demonstrated superior heat dissipation performance than the other two under different conditions. Placing thermal vias closer to the heat source enhances heat dissipation efficiency. Thermal vias positioned beneath the thermal pad were particularly effective. Increasing thermal via quantity and diameter improved heat dissipation, with square distribution layouts showing advantages. However, excessive copper plating thickness can increase thermal resistance and hinder heat dissipation.

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Section: Introductionmentioning

confidence: 99%

Effect of Thermal via Design on Heat Dissipation of High-Lead QFN Packages Mounted on PCB

Yuan,

Ding,

Zhang

2023

Applied Sciences

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“…Such warpage may cause difficulty and reliability issues in following processes, such as singulation and board assembly. Many efforts have been done to investigate the processinduced warpage of the QFN package by using both numerical and experimental approaches [2][3][4][5][6]. In order to release the residual stress generated during packaging, hence reduce strip warpage, stress relief slots are usually designed around the perimeter of leadframe unit arrays (See Fig.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of the effect of stress relief slots on QFN strip warpage using finite element analysis

Cheng

Tan

Wang

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

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QFN (Quad Flat No-lead) packages become popular in recent years because they provide many advantages over conventional leadframe packages.Due to CTE (Coefficient of Thermal Expansion) mismatch of different materials applied in the package, significant warpage will be generated during QFN packaging process, and may cause yield and reliability issues. In this paper, the warpage of a QFN strip induced by molding process was simulated using finite element analysis (FEA). Effect of stress relief slots design of the leadframe was evaluated, and the influence of material properties was also studied with three different types of EMC (Epoxy Molding Compound). Simulation results indicated that CTE of the EMC had a considerable effect on the warpage direction and magnitude, and the existence of stress relief slots only slightly reduced warpage magnitude.

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“…FNs (Quad-Flat No Leads) are one of the most successful packages today in the consumer electronics market. Compared to other no-lead packages, they offer small form factor, good electrical and thermal performance, and are generally lower in cost [1][2][3]. Manufacturers of high reliability electronic systems, who rely on the commercial electronics supply chain for advanced packages, are showing increased interests in using QFNs in their systems in order to meet miniaturization and functionality goals [4].…”

Section: Introductionmentioning

confidence: 99%

“…Another benefit from the use of conformal coating is it can reduce the risk of tin-whiskers on pure tin surface finishes [7][8][9][10]. Although the thermal cycling reliability of QFNs has been previously studied [1][2][3], there is a lack of understanding about the impact of using conformal coating on the reliability of these components [4].…”

Section: Introductionmentioning

confidence: 99%

Thermomechanical Analysis of Conformally Coated QFNs for High-Reliability Applications

Yin

Stoyanov

Bailey

et al. 2019

IEEE Trans. Compon., Packag. Manufact. Technol.

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The use of Quad Flat No-leads (QFNs) in high reliability applications is receiving increased interest. To address concerns of harsh working environments, conformal coatings are used to protect the components and associated printed circuit board (PCB). However, using conformal coatings can pose a reliability risk for the components on the PCB. This paper details an investigation into the effect of conformal coatings on the reliability of QFN second-level solder interconnections. Five QFN package types and two types of conformal coatings were investigated. In the experiments, a large population of QFN assemblies coated with conformal coatings were subjected to a thermal cycling test condition. These components, designed with daisy chain connections, were monitored during the thermal cycling tests and the exact time for failure to occur for each component was recorded and analyzed. Detailed finite element models for the tested QFN assemblies were developed, the inelastic strain energy density was used as the damage indicator to evaluate the impact of conformal coating on the solder joint reliability. Modelling results reveals that conformal coating plays a complex role in QFN solder joint reliability, the presence of conformal coating results in a reduction in the shear stress in the solder joint and plays a positive role in solder reliability, but it also induces more stress in the solder joint in the out-of-plane direction and plays a negative role. These two mechanisms are competing and the relative magnitude of them will determine the overall effect of conformal coating on solder joint reliability.

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Comparative analysis of reliability between dual-row and conventional QFN packages

Cited by 7 publications

References 6 publications

Effect of Thermal via Design on Heat Dissipation of High-Lead QFN Packages Mounted on PCB

Effect of Thermal via Design on Heat Dissipation of High-Lead QFN Packages Mounted on PCB

Evaluation of the effect of stress relief slots on QFN strip warpage using finite element analysis

Thermomechanical Analysis of Conformally Coated QFNs for High-Reliability Applications

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