Effect of Thermal via Design on Heat Dissipation of High-Lead QFN Packages Mounted on PCB
Ziyi Yuan,
Dongyan Ding,
Wenlong Zhang
Abstract:The quad flat no-lead package (QFN) is widely used in integrated circuits due to its advantages in performance and cost. With the increasing power of electronic products, effective heat dissipation from QFN packages has become crucial to prevent product damage. The focus of this study is to investigate the thermal performance of QFN packages soldered onto printed circuit boards (PCB) by finite element analysis (FEA). Conventional QFN, dual-row QFN, and high-lead QFN packages were modeled and compared by ANSYSY… Show more
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