2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC) 2013
DOI: 10.1109/aspdac.2013.6509589
|View full text |Cite
|
Sign up to set email alerts
|

Compact nonlinear thermal modeling of packaged integrated systems

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Year Published

2013
2013
2021
2021

Publication Types

Select...
2
2

Relationship

1
3

Authors

Journals

citations
Cited by 4 publications
references
References 18 publications
0
0
0
Order By: Relevance