Compact multiplexer modules for multi-band wireless systems using LTCC technology

Abstract

Abstract:Recently, compact wireless modules are very significant parts for multi-band wireless systems such as mobile phones and compact personal computers. A low temperature co-fired ceramic (LTCC) substrate which has embedded passive components is effective technology for producing the compact modules, because this substrate is suitable for a multilayer structure and is also a low dielectric loss and a low conductor loss. Therefore, a lot of multi-band wireless systems use this technology. In the radio frequency circuits of the multi-band wireless systems, a multiplexer is one of the most important passive circuits, in order to achieve both a compact size and high performances. In this paper, we report the technology of the compact multiplexer modules using the LTCC substrate. This paper especially focuses on the multiplexer for ultra-wideband wireless systems. The multiplexer which is suitable for narrow band wireless systems is also described. Keywords: low temperature co-fired ceramic (LTCC) substrate, module, multiplexer, multi-band wireless system, surface acoustic wave (SAW) filter, ultra-wideband (UWB) Classification: Microwave and millimeter wave devices, circuits, and systems "A compact multilayer triplexer using an ultra-wideband diplexer and a low-pass filter for 2.4 GHz wireless systems," IEICE Electron. Express, vol. 9, no. 12, pp. 1075-1080, June 2012 H. Mandai, T. Tsuru, and N. Nakajima, "Advanced multi-layer ceramic surface-mount functional components for telecommunications equipment," Proc. 45th Electronic Components and Technology Conf., 1995, pp. 247-250, May 1995. [15] G. Wang, M. Van, F. Barlow, and A. Elshabini, "An interdigital bandpass filter embedded in LTCC for 5-GHz wireless LAN applications," IEEE Microw. Wireless Compon. Lett., vol. 15, no. 5, pp. 357-359, May 2005. [16] C. -C. Weng, C. -F. Chang, and S. -J. Chung, "Development of a compact low-temperature co-fired ceramic antenna front-end module," IEEE Trans. Microw. Theory Tech., vol. 56, no. 11, pp. 2483-2492, Nov. 2008 T. Ishizaki, M. Fujita, H. Kagata, T. Uwano, and H. Miyake, "A very small dielectric planar filter for portable telephones," IEEE Trans. Microw. Theory Tech., vol. 42, no. 11, pp. 2017-2022, Nov. 1994 References

Novel double fractal patches structure Antenna-in-Package based on LTCC technology for 2.4 GHz applications

“…Meanwhile, it can also be realized by adjusting the height or the length of this air cavity. LTCC substrate is manufactured by laminating many layers of green sheets . The reason why the air cavity can enhance the bandwidth is analyzed as follows.…”

“…LTCC substrate is manufactured by laminating many layers of green sheets. 14 The reason why the air cavity can enhance the bandwidth is analyzed as follows. Its effective dielectric constant is estimated by an equation:…”

A compact 2-18GHz ultra-wideband frequency-conversion T/R module based on a 3D heterogeneous integrated process

“…Due to its large dimensions, it is not conducive to system integration. In order to achieve miniaturization, some modules adopt a ceramic package with ball grid array (BGA) and high/low-temperature co-fired ceramic (HTCC/LTCC) technology for fabrication [10][11][12][13][14][15][16][17][18][19][20], which increases the module integration to some extent. However, these designs still employ a two-dimensional (2D) multichip module (MCM) package, the minimum sizes of which are limited by the sizes of the applied chips.…”

Investigation on the micro-structure and magnetic properties of LMZBS-Bi2O3 doped low-temperature sintered NiCuZn ferrites

“…Sintering NiCuZn ferrites at low temperatures is of great significance for the miniaturization and integration of magnetic devices and has attracted extensive attention. Low temperature sintering refers to the co-firing of silver electrodes and ceramics, so the sintering temperature must be lower than the temperature of 961 °C of melting point of Ag [14][15][16][17][18]. In recent decades, the preparation of ferrites by sintering at low temperature has received extensive attention.…”