2013
DOI: 10.1002/9783527647132.ch8
|View full text |Cite
|
Sign up to set email alerts
|

Compact Modeling of RF‐MEMS Devices

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2013
2013
2018
2018

Publication Types

Select...
3
2

Relationship

0
5

Authors

Journals

citations
Cited by 6 publications
(1 citation statement)
references
References 17 publications
0
1
0
Order By: Relevance
“…The first solution enables coupling of multiple physical domains and resolution of complex problems typically linked to MEMS devices, as reported in [12,13], despite at the expense of significant computational loads and simulation time. On the other hand, compact modeling of MEMS problems enables fast behavioral analysis of coupled electromechanical problems, as discussed in [14,15], leading to rather accurate description of Microsystem based complex networks [16,17]. Furthermore, proper packaging and encapsulation of RF-MEMS devices is necessary for their optimal operation and final integration.…”
Section: Introductionmentioning
confidence: 98%
“…The first solution enables coupling of multiple physical domains and resolution of complex problems typically linked to MEMS devices, as reported in [12,13], despite at the expense of significant computational loads and simulation time. On the other hand, compact modeling of MEMS problems enables fast behavioral analysis of coupled electromechanical problems, as discussed in [14,15], leading to rather accurate description of Microsystem based complex networks [16,17]. Furthermore, proper packaging and encapsulation of RF-MEMS devices is necessary for their optimal operation and final integration.…”
Section: Introductionmentioning
confidence: 98%