Combining Textiles and Electronics: Market Trend and Laundering Testing Challenges of E-Textiles (IMPACT 2018)

Lo, Natalia; Chen, Cheng Chih; Lee, Dem; Yao, Leo; Lee, Jeffrey

doi:10.1109/impact.2018.8625741

Cited by 3 publications

(2 citation statements)

References 2 publications

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“…Portanto, observa-se que o desenvolvimento de produtos wearables, em especial os têxteis vestíveis, possuem elementos favoráveis para investigação. Devido ao potencial de desenvolvimento e aplicabilidade das tecnologias vestíveis (GONÇALVES et al, 2018;HARJUNIEMI;HÄKKILÄ, 2018;LO et al, 2018;WANG et al, 2018;ZEAGLER, 2018) a inserção destas passou a ser de interesse comum de diversas empresas e pesquisadores.…”

Section: Wearables Tecnologiesunclassified

Potencialidades E Restrições Presentes No Processo De Inserção De Wearables No Ecossistema Da Moda

Serrano

FORTUNATI

2022

Anais Do Encontro Nacional De Engenharia De Produção

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Section: Wearables Tecnologiesunclassified

Potencialidades E Restrições Presentes No Processo De Inserção De Wearables No Ecossistema Da Moda

Serrano

FORTUNATI

2022

Anais Do Encontro Nacional De Engenharia De Produção

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“…Laundry represents the greatest stress load of e-textile products because the product in an automated washing machine has to withstand various external mechanical forces and chemical stress, such as soaking in detergent-added water, spinning and twisting. 22 The current methods used for integrating SMD electronic components onto conductive textiles include adhesive bonding with a conductive adhesive. The disadvantage of this process is a long curing time, and there is another necessary process step for encapsulation.…”

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confidence: 99%

Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons

Hirman

Navrátil

Steiner

et al. 2022

Textile Research Journal

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This article addresses the research and development of a reliable interconnection technique for mounting surface mounted device components onto newly developed conductive stretchable textile ribbons. The alternative nonconductive adhesive bonding in which electrical contact is realized only by mechanical pressure and fixed by an adhesive and the conventional soldering technique were selected for examination. Assessment of the performance of these techniques and their usability for interconnecting components on conductive textile ribbons was also our research goal. Reliability tests of the electrical and mechanical properties of realized interconnections (dry heat, damp heat, washing, electrical current load, jerk, and stretch tests) were realized. The results show that the nonconductive adhesive technique results in good mechanical properties and acceptable median electrical resistance of less than 2 Ω even after 90 washing cycles. It is also very gentle and fully compatible with textile production due to the maximal processing temperature lower than 70°C, without the risk of short circuit occurrence. This technique is suitable for sensors, illumination or data transfer applications. While soldering results in excellent median electrical resistance of less than 20 mΩ, it is more complex and costly. Moreover, there is a risk of short circuits as well as of textile damage by the high thermal load over 150°C. Soldering is more suitable for power supply applications or heating. The above-mentioned results were also confirmed in a decision analysis with pairwise comparisons, involving company representatives considering introducing the above-mentioned interconnection techniques into their production. The nonconductive adhesive technique was evaluated as 15% better in overall decision analysis than the low-temperature soldering.

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New Recycling Procedure of SMD Components for Reuse in E-Textiles in Accordance to the Green Deal Policy

Hirman

Benešová

Navrátil

et al. 2023

Lecture Notes in Mechanical Engineering

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Combining Textiles and Electronics: Market Trend and Laundering Testing Challenges of E-Textiles (IMPACT 2018)

Cited by 3 publications

References 2 publications

Potencialidades E Restrições Presentes No Processo De Inserção De Wearables No Ecossistema Da Moda

Potencialidades E Restrições Presentes No Processo De Inserção De Wearables No Ecossistema Da Moda

Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons

New Recycling Procedure of SMD Components for Reuse in E-Textiles in Accordance to the Green Deal Policy

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