2022
DOI: 10.1515/nanoph-2021-0733
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Combining one and two photon polymerization for accelerated high performance (3 + 1)D photonic integration

Abstract: Dense and efficient circuits with component sizes approaching the physical limit is the hallmark of high performance integration. Ultimately, these features and their pursuit enabled the multi-decade lasting exponential increase of components on integrated electronic chips according to Moore’s law, which culminated with the high performance electronics we know today. However, current fabrication technology is mostly constrained to 2D lithography, and thermal energy dissipation induced by switching electronic s… Show more

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Cited by 19 publications
(17 citation statements)
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“…Combining one-and two-photon polymerization is also a feasible way for photonic integration. [754] Moreover, with the recent development of cw laser polymerizable photoresists, [755][756][757] cost-effective and high-power 3D TPL printing systems may bring new possibilities for industrial mass production, and also minimization into highly integrated equipment. [758] In addition, multimaterial printing is promising as different parts of the structure can be fabricated and integrated within one step for multifunctional applications.…”
Section: Challenges and Perspectivementioning
confidence: 99%
See 1 more Smart Citation
“…Combining one-and two-photon polymerization is also a feasible way for photonic integration. [754] Moreover, with the recent development of cw laser polymerizable photoresists, [755][756][757] cost-effective and high-power 3D TPL printing systems may bring new possibilities for industrial mass production, and also minimization into highly integrated equipment. [758] In addition, multimaterial printing is promising as different parts of the structure can be fabricated and integrated within one step for multifunctional applications.…”
Section: Challenges and Perspectivementioning
confidence: 99%
“…Combining one‐ and two‐photon polymerization is also a feasible way for photonic integration. [ 754 ] Moreover, with the recent development of cw laser polymerizable photoresists, [ 755–757 ] cost‐effective and high‐power 3D TPL printing systems may bring new possibilities for industrial mass production, and also minimization into highly integrated equipment. [ 758 ]…”
Section: Challenges and Perspectivementioning
confidence: 99%
“…This can be performed in two ways: 1) using two different photo resists, one for the core and one for the cladding, [107] or 2) by controlling the degree of polymerization (cross-linking), hence its n, of a single photoresist. [62,[108][109][110][111] 5. Applications…”
Section: Waveguidesmentioning
confidence: 99%
“…Thus, it invites to refer to as (3+1)D writing as was named in the original report. [ 19 ] Such an approach extends the 3D photonic micro‐integration to a greater flexibility, [ 21 ] however, not fully empowers the capacity of MPL to create 3D arbitrary architectures down to microscale control. On the other hand, based on it some successful efforts were put into producing cell phantoms for biological applications, [ 22 ] However, there are no reports for the exploitation directly targeting the vast potential of micro‐optics.…”
Section: Introductionmentioning
confidence: 99%