2022
DOI: 10.1016/j.jtice.2022.104528
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Combined fluid flow simulation with electrochemical measurement for mechanism investigation of high-rate Cu pattern electroplating

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Cited by 10 publications
(2 citation statements)
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“…PEG polymers are composed of repeated ethylene oxide (C 2 H 4 O) subunits and the general molecular formula of PEG is HO(C 2 H 4 O) n H (Figure 1A) [1][2][3][4][5]. Due to their nonimmunogenic and non-antigenic properties, PEG polymers have been approved by the Food and Drug Administration (FDA) for pharmaceutical applications [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…PEG polymers are composed of repeated ethylene oxide (C 2 H 4 O) subunits and the general molecular formula of PEG is HO(C 2 H 4 O) n H (Figure 1A) [1][2][3][4][5]. Due to their nonimmunogenic and non-antigenic properties, PEG polymers have been approved by the Food and Drug Administration (FDA) for pharmaceutical applications [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…In general, the influencing factors of electrodeposition can be categorized into three aspects, including the electric field, fluid field, and chemical field. [11][12][13][14][15] However, the case of pattern electroplating is more complicated due to the nonuniform electric field, fluid field, and chemical field and their interactions. It is worth noting that the macroscale dimension inevitably affects the profile and microstructure when the characteristic size of pattern is decreased to a level comparable to grain size.…”
Section: Introductionmentioning
confidence: 99%