Combination of Experimental and Simulation Methods for Analysis of Sintered Ag Joints for High Temperature Applications

Weber, Constanze; Walter, H.; Dijk, Marius van; Hütter, Matthias; Wittler, Olaf; Lang, Klaus‐Dieter

doi:10.1109/ectc.2016.394

Cited by 25 publications

(13 citation statements)

References 5 publications

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“…The s-Ag of p was calculated based on cross sectional SEM images because the method could give enough information about microstructure of s-Ag without any troublesome [ 9 , 11 , 14 ]. Figure 3 shows representative cross-sectional SEM image of s-Ag along with the binary image after filtering.…”

Section: Resultsmentioning

confidence: 99%

“…However, by virtue of including many pores in s-Ag, it is very difficult to finely estimate the mechanical behaviors. To date, many researchers have tried to examine how porous affect the mechanical properties of s-Ag [ 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 ] by means of indentation test [ 20 ] and bending test [ 21 , 22 , 23 ]. Although the tensile test is one of the most basic mechanical property evaluation tests, these alternative mechanical tests have been utilized for the evaluation due to its technical simplicities.…”

Section: Introductionmentioning

confidence: 99%

“…We investigated its porosity-dependent tensile mechanical properties of s-Ag thin films (8–10μm thick) as a function of the size of the pores therein [ 11 ], and revealed that a porosity of around 5% was good as mechanical structural material. In addition, some researchers have tried to reveal the temperature dependency of the tensile mechanical properties of s-Ag [ 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 ]. C. Webber et al performed the tensile tests of s-Ag ( p : 5%) at room temperature (RT), 125 °C, 200 °C and found that the stress–strain ( S-S ) curves changed from brittle to ductile at 125 °C [ 14 ].…”

Section: Introductionmentioning

confidence: 99%

“…In addition, some researchers have tried to reveal the temperature dependency of the tensile mechanical properties of s-Ag [ 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 ]. C. Webber et al performed the tensile tests of s-Ag ( p : 5%) at room temperature (RT), 125 °C, 200 °C and found that the stress–strain ( S-S ) curves changed from brittle to ductile at 125 °C [ 14 ]. C. Chen et al also investigated s-Ag ( p : nearly = 25%) temperature dependence on its mechanical behaviors by tensile tests at temperatures from RT to 300 °C [ 16 ].…”

Section: Introductionmentioning

confidence: 99%

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Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film

et al. 2020

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This paper investigates the influence of temperature on tensile mechanical properties of sintered silver (s-Ag) films with 8–10 μm in thickness for fundamental reliability design of semiconductor systems. The s-Ag film sintered under a pressure of 60 MPa possesses the porosity (p) around 5% determined from cross-sectional scanning electron microscope (SEM) images. The stress–strain (S-S) curves of s-Ag and pure silver (p-Ag) films are obtained using originally designed uniaxial tensile tester at temperatures from 25 °C to 150 °C. The S-S curves of p-Ag indicate ductile behavior irrespective of temperature, whereas those of s-Ag indicate brittle-ductile transition at 120 °C. Compared with p-Ag, s-Ag possesses low Young’s modulus (E) and high ultimate tensile strength (UTS) below 80 °C. The mechanism of brittle-ductile transition is discussed based on fracture surface observation results.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film

et al. 2020

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“…Since the processing temperature is quite high, so the elastic-plastic models are applied for sintered Ag layer and Cu lid. The Garofalo law is a time dependent model, which describes the function between stress and temperature with a sine hyperbolic creep law was used for sintered Ag layer, can be expressed in equation 1 [24]:…”

Section: Fig 2 3d Structure Of a Quarter Model For Simulationmentioning

confidence: 99%

A new hermetic sealing method for ceramic package using nanosilver sintering technology

Zhang

Liu

Wang

et al. 2018

Microelectronics Reliability

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High reliable packaging materials are needed for electronics when they work at harsh environments. Among which, the nanosilver material has been widely studied and applied in power electronics due to its low processing temperature and high reliability. This paper investigates the bonding properties of nanosilver sintered hermetic cavity. There are two kinds of lids used in this study, including copper lid and silicon lid. The X-Ray and C-Mode Scanning Acoustic Microscopy (C-SAM) results revealed that delamination tended to happen in Cu lid sintered cavity as the recovery of deformed Cu lid was hindered by sintered dense Ag layer. However, no delamination or cracks were found in Si lid sintered cavity. Finite element analysis (FEA) method was used to investigate the effects of lid materials on the stress distribution of lid. The results indicated that the Cu lid sintered cavity showed a much higher stress than the Si lid sintered cavity under the sintering parameters of 250C and 10 MPa. There is no obvious change in the stress distribution areas on Cu lid with the increasing of pressures from 5 to 30 MPa. However, the distribution area of stress on Si lid expanded obviously only when the sintering pressure increased to 30 MPa. With the increase of sintering pressures from 5 to 30 MPa, the maximum stresses on Cu lid are almost the same, while increasing trend was found on Si lid.

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