Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining

Abstract

A facile method for producing high-performance nickel enhanced silver nanowire (Ag NW) transparent electrodes on a flexible substrate is reported. The modified electroplating method called enhanced nickel ion bridge joining of Ag NWs, which provides a new route for improving the loose junctions in bare Ag NW networks. The sheet resistance of Ag NW electrode drops from over 2000 Ω sq−1 to 9.4 Ω sq−1 with excellent thermal uniformity after the electroplating process within 10 s. Nickel enhanced Ag NW transparent films are applied on flexible heaters with good thermal stability (165 °C for 2 h) and mechanical flexibility (3500 cycles under 2.5 mm bending radius) after mechanical bending process. Moreover, the mechanism of nickel growth is also confirmed that the nickel electroplating of the Ag NWs obeyed Faraday’s Laws.

Highly Thermal Conductive and Electrical Insulating Epoxy Composites with a Three-Dimensional Filler Network by Sintering Silver Nanowires on Aluminum Nitride Surface

“…To verify the electrical conductivity of the 3D network and composites caused by AgNW addition, the electrical conductivities of the 3D network and composites were measured before and after their impregnation with the EP resin ( Figure 8 ). Compared with the electrical conductivity of the AgNWs (6.3 × 10 5 S cm −1 ) [ 20 ], the electrical conductivities measured at AlN-to-AgNW ratios of 1:2, 1:1, 2:1, and 3:1 decreased to 10.1, 9.3, 9, and 8.7 S cm −1 , respectively ( Figure 8 a). This phenomenon resulted from the insulating effect produced by the addition of AlN particles, which impeded the electronic movement between the AgNWs.…”

“…Ag has received much attention from researchers, owing to its high electrical conductivity (6.30 × 10 7 S m −1 ) and thermal conductivity (427 W m −1 K −1 ) as compared with those of other metals [20]. In addition, AgNWs and Ag nanoparticles have been used in various fields, including catalysis [21], microelectronics [22] and thermally conductive composites [23].…”

“…AlN is a popular ceramic filler that is used to fabricate highly thermally conductive and insulating composites because of its intrinsically low dielectric constant (8.8), excellent electrical resistance (> 10 14 Ω·cm), high thermal conductivity (100–300 W m −1 K −1 ), and low thermal expansion coefficient (4 × 10 −6 K −1 ) [ 19 ]. Ag has received much attention from researchers, owing to its high electrical conductivity (6.30 × 10 7 S m −1 ) and thermal conductivity (427 W m −1 K −1 ) as compared with those of other metals [ 20 ]. In addition, AgNWs and Ag nanoparticles have been used in various fields, including catalysis [ 21 ], microelectronics [ 22 ] and thermally conductive composites [ 23 ].…”

Copper nanomaterials and assemblies for soft electronics

“…The reactive surface of Cu nanomaterials may be protected by more inert metal layers by various chemical or electrochemical means to form core-shell structures [140]. This strategy leaves few sites for oxygen or water to attack the interior atoms, therefore enhancing the stabi-lity [143][144][145].…”

Recycling silver nanoparticle debris from laser ablation of silver nanowire in liquid media toward minimum material waste

“…The unique advantage of this method is that the recycled Ag NPs are used as building materials for fabricating Ag NWs decorated with Ag NPs, so there is nearly no additional cost incurred for junction welding of the Ag NWs. This process is superior in terms of the cost compared to the methods developed in previous research, which used complex processes or additional materials such as light-induced welding 2,[39][40][41][42] , synthetic methods [43][44][45] , chemical soldering 46,47 , electrochemical metal deposition [48][49][50][51] , and polymer coating 45,52,53 . Through PLAL and EPD, a patterned substrate of Ag NWs decorated with Ag NPs was formed and used as a transparent heater and stretchable TCE, confirming that the process is suitable for practical applications.…”