Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint

Sun, Pengtao; Andersson, Cristina; Wei, Xicheng; Cheng, Zhaonian; Shangguan, Dongkai; Liu, Johan

doi:10.1108/09540910610665071

Cited by 12 publications

(7 citation statements)

References 12 publications

(13 reference statements)

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“…Thus, the intermetallics could be identified as (Cu,Ni) 6 Sn 5 . According to Sun et al 21 in binary Cu 6 Sn 5 IMCs, the atomic percentage of Sn is around 45. Moreover, the difference in atomic size between Ni and Cu is only 2 and both the elements have same FCC lattice structure, the addition of Ni into Cu 6 Sn 5 without causing lattice distortion or a new phase formation is possible.…”

Section: Resultsmentioning

confidence: 97%

Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu, Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate

Narayan

Prabhu

2013

Materials Science and Technology

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In the present work, spreading behaviour and development of interfacial microstructure in Sn-0?7Cu, Sn-0?3Ag-0?7Cu and Sn-2?5Ag-0?5Cu lead free solder alloys on Fe-42Ni substrates having two different surface textures were investigated. Smooth textured surfaces yielded better wettability than rough surfaces particularly for Sn-0?7Cu solder alloy. Wettability of Sn-0?7Cu solder on rough textured surfaces was found to be poor compared to other solder alloys. Spreading of Sn-0?7Cu solder on substrate surface showed longer viscous regime, Sn-2?5Ag-0?5Cu solder exhibited shortest viscous regime. Sn-0?3Ag-0?7Cu solder showed intermediate behaviour. Sn-Cu solder alloy exhibited needle and coarse shaped (Cu,Ni) 6 Sn 5 intermetallics at the interface and solder matrix on smooth substrate, whereas on rough substrate, only coarse shaped (Cu,Ni) 6 Sn 5 intermetallic compounds (IMCs) was observed. For Sn-0?3Ag-0?7Cu solder alloy, Fe-Ni-Sn and FeSn 2 IMCs identified at the interface. (Cu,Ni) 6 /Sn 5 IMCs were found to be less coarser than as observed at Sn-0?7Cu/substrate interface. Sn-2?5Ag-0?5Cu alloy exhibited (Cu,Ni) 3 Sn 4 and (Cu,Ni) 6 Sn 5 IMCs at the interface and in the bulk of solder alloy.

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Section: Resultsmentioning

confidence: 97%

Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu, Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate

Narayan

Prabhu

2013

Materials Science and Technology

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“…to have longer fatigue life than Sn-37Pb at room temperature [22,23]. Solomon et al [31] found that the IF resistance of both eutectic Sn-Ag and Sn-40Pb single lap joints decrease with increasing the temperature and the fatigue life of lead-free solder joints to be longer than that of leaded solder joints at both 35°C and 150°C.…”

Section: Discussionmentioning

confidence: 99%

“…They showed that the symmetry of triangular waves had no significant effect on crack initiation or life for lead-free micro specimens, in contrast to the reductions observed for large size specimens. Peng et al [22,23] determined the Coffin-Manson constants for the low cycle fatigue life of Sn-8Zn-3Bi solder joints, using Sn-37Pb eutectic as a reference. Duek et al [24] carried out low cycle isothermal fatigue tests on 96.5Sn-3.0Ag-0.5Cu solder joints at 24°C, 30°C, 60°C, 100°C, and 125°C with fixed constant displacement amplitude.…”

Section: Introductionmentioning

confidence: 99%

Microstructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder joints

Ghaleeh

Baroutaji

Qubeissi

2020

Engineering Failure Analysis

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The reliability of solder joints is a critical issue in the microelectronics industry. The requirement of permanent electrical and thermal connections between solder alloys and the various components of a surface mount device is dependent upon the mechanical integrity of the solder and its interfaces.Accordingly, in this paper, the reliability of lead-free, Sn-3.8Ag-0.7Cu, and leaded, Sn-37Pb, solder alloys was investigated under both thermal-mechanical fatigue (TMF) and isothermal mechanical fatigue (IF) conditions. The investigation included material characterisation and fatigue testing on 4-ball grid array (BGA) specimens. The IF tests were carried out under load control at three different temperatures including Room Temperature (RT), 35°C and 75°C. Also, a set of 'not-in-phase' (nIP), 'in-phase' (IP) and 'out-of-phase' (OoP) combined thermal and mechanical cycling tests were carried out to investigate the TMF behaviour of the solders. The stress-life curves for each test condition were generated and then compared taking into account the observations on microstructure.It was found that the IF and TMF performance of Sn-3.8Ag-0.7Cu alloy was better than Sn-37Pb alloy when expressed as stress-life curves. Additionally, the Sn-3.8Ag-0.7Cu was less susceptible to the changes in temperature. This study provides a comprehensive insight into the reliability of solder alloys under a wide range of loading conditions.

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“…If the cycles have sufficient half-cycle dwell times to result in complete stress-relaxation/creep, then ∆D = ∆W. Englemaier has suggested that the fatigue ductility exponent is a function of temperature and time: [172] 0.37 63Sn-37Pb Anderson, et al [97] 0.42 SAC Lee, et al [98] 0.43 Sn-Cu Kariya, et al [173] 0.44 SAC Lee, et al [98] 0.57 Sn-Ag Akay, et al [165] 0.63 SAC Wu, et al [166] 0.68 SAC Lee, et al [98] 0.74 SAC Lee, et al [94] 0.87 Sn-Ag-Bi Pang, et al [174] 0.99 Sn-Cu Kanchanomai, et al [176] 1.14 Sn-Ag-Cu-Bi [91] 0.37 Sn-Pb Anderson, et al [100] 0.42 SAC Kanda, et al [91] 0.49 SAC Lau, et al [100] 0.51 SAC Akay, et al [165] 0.63 SAC Wu, et al [166] 0.68 SAC Shi, et al [70] 0.70 Sn-Pb Pang, et al [101] 0.87 SAC0387 Kim, et al [92] 0.88 SAC405 Ahmer, et al [167] 1.00 SAC Jung, et al [168] 1.00 63Sn37Pb Dudek, et al [169] 1.00 SAC Pang, et al [170] 1.07 SAC at 25C Chi, et al [171] 1.10 SAC Lee, et al [98] 1.17 Sn3.5Ag7.5Bi…”

Section: Fatigue Life Predictionmentioning

confidence: 99%

The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders

Mustafa

Roberts

Suhling

et al. 2013

Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; M

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Solder joints in electronic assemblies are typically subjected to thermal cycling, either in actual application or in accelerated life testing used for qualification. Mismatches in the thermal expansion coefficients of the assembly materials cause the solder joints to be subjected to cyclic (positive and negative) mechanical strains and stresses. This cyclic loading leads to thermomechanical fatigue damage that involves damage accumulation, crack initiation, crack propagation, and failure. In addition, the microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. While the effects of aging on solder constitutive behavior (stress-strain and creep) have been examined in some detail, there have been no prior studies on the effects of aging on solder failure and fatigue behavior. Aging leads to both grain and phase coarsening, and can cause recrystallization at Sn grain boundaries. Such changes are closely tied to the damage that occurs during cyclic mechanical loading. In this investigation, we have examined the effects of aging on the cyclic stress-strain behavior and fatigue life of lead free solders. Uniaxial solder test specimens (SAC105 and SAC305) have been prepared and subjected to cyclic stress/strain loading at different aging conditions. A four-parameter hyperbolic tangent empirical model has been used to fit the entire cyclic stress-strain curve and the hysteresis loop size (area) was calculated using definite integration for a given strain limit. This area represents the energy dissipated per cycle, which is correlated to the damage accumulation in the joint. Using the recorded cyclic stress-strain curves, the evolution of the solder hysteresis loops with aging have been characterized and empirically modeled. Similar to solder stress-strain and creep behavior, there is a strong effect of aging on the hysteresis loop size (and thus the rate of damage accumulation) in the solder specimens. Fatigue experiments were also performed, where the uniaxial specimens were subjected to cyclic loading over a particular strain range until failure. Fatigue failure in the experiments was defined to occur when there was a 50% peak load drop during mechanical cycling. Prior to testing, the specimens were aged (preconditioned) at 125 °C for various aging times, and then the samples were subjected to cyclic loading at room temperature (25 °C). It was found that aging decreased the mechanical fatigue life, and the effects of aging on the peak load drop have been studied. It has also been observed that degradations in the fatigue/failure behavior of the lead free solders with aging are highly accelerated for lower silver content alloys (e.g., SAC105). Various empirical failure criteria such as the Coffin-Manson model and the Morrow model have been used to fit the measured data, and the parameters in the models have been determined as a function of the aging conditions.

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Coffin‐Manson constant determination for a Sn‐8Zn‐3Bi lead‐free solder joint

Cited by 12 publications

References 12 publications

Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu, Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate

Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu, Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate

Microstructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder joints

The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders

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