2008
DOI: 10.1016/j.surfcoat.2007.08.002
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Coefficients of thermal expansion of thin metal films investigated by non-ambient X-ray diffraction stress analysis

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Cited by 26 publications
(11 citation statements)
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“…Rupp and Birringer have found the TEC values for NC copper with a 8‐nm grain size to be nearly twice that of those in regular polycrystalline copper. An increasing TEC was also observed for Cu, Ni, and Pd nanoparticles via in‐situ X‐ray diffraction measurements.…”
Section: Introductionmentioning
confidence: 71%
“…Rupp and Birringer have found the TEC values for NC copper with a 8‐nm grain size to be nearly twice that of those in regular polycrystalline copper. An increasing TEC was also observed for Cu, Ni, and Pd nanoparticles via in‐situ X‐ray diffraction measurements.…”
Section: Introductionmentioning
confidence: 71%
“…This thermal stress component is expected to be compressive during heating, since a s ¼ 0.56$10 À6 K À1 [54] and a f ¼ 11.8$10 À6 K À1 [55]. Finally, the extrinsic stress s e , caused by structural misfits, phase transformations, plastic or creep deformation, chemical reactions, etc.…”
Section: In-situ Study Of Microstructural Changes During Annealingmentioning
confidence: 99%
“…Email: anderson.1@osu.edu has been used to study single-layer metallic films on substrates. [16][17][18][19] For Al [18] and Cu films [20] on Si substrates, it provides values of film stress comparable to those from curvature measurements. Despite this extensive work, in situ X-ray diffraction has not been reported for multilayers.…”
Section: Abstract: Nanolaminates X-ray Diffraction Interface Propermentioning
confidence: 77%