Codeposition of Alpha- and Gamma-Alumina with Copper from Copper Sulphate Baths

Roos, Jozef; Célis, Jean-Pierre; Helsen, Jozef

doi:10.1080/00202967.1977.11870431

Cited by 33 publications

(23 citation statements)

References 8 publications

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“…Lakshminarayanan et al [619][620][621] concluded that a-and c-alumina could be codeposited provided that the plating solution was free of chloride. By contrast, Roos et al [622] reported that both c-and a-alumina could be codeposhed in an acid sulfate solution with or without the presence of chloride ions in the solution. However, under identical conditions, much smaller quantities of c-alumina were codeposited as compared with a-alumina.…”

Section: Aluminamentioning

confidence: 99%

Electrodeposition of Copper

Dini

Snyder

2010

Modern Electroplating

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Polyethylene oxides, glycols, and amines U.S.5,024,736 6/18/91 Clauss et al. Disubstituted ethane sulfonic compounds U.S.4,990,224 2/5/91 Mahmoud Urea, sodium lauryl sulfate, and tosyl or mesyl sulfonic acid U.S.4,975,159 12/4/90 Dahms Alkoxylated lactam amides U.S.4,954,226 9/4/90 Mahmoud Urea and glycerin U.S.4,948,474 8/14/90 Miljkovic Alkylarylene U.S.4,897,165 1/30/90 Bernards et al. Copper/sulfuric acid ratios U.S.4,781,801 11/1/88 Frisby Polyether surfactants þ sulfurized benzene þ grain refiner U.S.4,673,467 6/16/87 Nee Polyethers þ mercaptoimidazole þ sulfurized benzene U.S.4,555,315 11/26/85 Barbieri et al. Polyethers þ organic divalent sulfur compound þ tertiary alkyl amine with polyepichlorohydrin U.S.4,551,212 11/5/85 Rao et al. Phenazine dyestuffs U.S.4,540,473 11/22/83 Bindra et al. S-containing anions other than SO 4 U.S.4,521,282 7/11/84 Tremmel Sulfamic acid U.S.4,490,220 12/25/84 Houman Nitrogen-carbon-sulfur compound U.S.4,430,173 2/7/84 Boudot et al. Sodium salt of W-sulfo-n-propyl N,N-diethyldithiocarbamate, PEG, and crystal violet U.S.4,376,685 6/24/81 Watson Alkylated polyalkyleneimine U.S.4,347,108 8/31/82 Willis Nitrogen-and sulfur-containing compounds U.S.4,336,114 6/22/82 Mayer et al. Phthalocyanine, tertiary alkyl amine with polyepichloro hydrin, polyethyleneimine U.S.4,334,966 12/2/81 Beach et al. Polyether, mercaptoimidazole, sulfurized benzene U.S.4,310,392 1/12/82 Kohl Phenolphthalein U.S.4,272,335 2/19/80 Combs Substituted phthalocyanine radical U.S.4,242,181 12/30/80 Malak Regular coffee U.S.4,134,803 1/16/79 Eckles et al. Disulfides, sulfonic acids, and aliphatic aldehyde U.S.4,110,176 8/29/78 Creutz et al.

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Section: Aluminamentioning

confidence: 99%

Electrodeposition of Copper

Dini

Snyder

2010

Modern Electroplating

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“…Since these properties are strongly governed by the volume fraction of the particles codeposited in the coating, many efforts have been made to correlate the amount of codeposited particles to the process parameters. These parameters include the bath composition and the concentration of suspended particles in the bath; the particle form, size and size distribution; the addition of surfactant and metallic ions; and the electroplating parameters such as temperature, pH, the type of imposed current, current density, and the type and degree of agitation [2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Annealing behavior of electrodeposited Ni-TiO2 composite coatings

Lin

Lee

Chang

2006

Surface and Coatings Technology

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“…Following on from the research described above and from research carried out in their own laboratories on the mechanism of codeposition of alumina with copper and nickel (35), C. Buelens et al have recently published the results of a study of the electrochemical aspects of codeposition of 'y-alumina with gold and copper from acid cyanide and sulphate electrolytes respectively (21).…”

Section: Factors Affecting Particle Codepositionmentioning

confidence: 99%

Electrodeposited gold composite coatings

Larson¹

1984

Gold Bull

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The special properties exhibited by electrodeposited composite coatings have ensured industrial applications for them as a result of the high specification demands of modern technology. Recent advances in the understanding of the mechanism offormation of such coatings, including those involving gold matrices, and awareness of the properties of the latter, justify interest in theirpotential applications.The past two decades have seen a steady increase in our knowledge and understanding, and most importantly our application of composite coatings formed by electrodeposition from aqueous suspensions of inert particles. A number of systems have progressed to the stage of having become completely accepted in high-technology industrial applications. These have evolved largely as a result of the improved wear resistance characteristics imparted by the composite coatings. Such applications have included the incorporation of silicon carbide particles into nickel electrodeposits on the contacting faces of Wankel engine housings (1), and cobaltchromium carbide composite coatings for high-temperature dry slidingwear in gas-turbine aeroengines (2, 3, 4). E. C. Kedward (4) has reviewed research carried out in the field of electrodeposited composite coatings to 1973.It is, in fact, a measure of the understanding and appreciation of the properties which can be achieved by incorporating second phase particles into deposits that practical applications have also been found for electroless (autocatalytic) composite coatings. The inherent corrosion resistance of electroless nickel, its high hardness in the heat-treated form, and the fact that it can be deposited F. 1E éctbaal'yrnYdacoriteptohthe^reëpi [ ó eléctradcjwsitéd ldalumit a compo i6 s3 Au testrit t ttte hnene s of. he jarticírs.(0 02 n Sf arireterl n1y a''low`wIume perenu&e u. µhe camposite , 1s técuur^d to 0flpto crb4l

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Codeposition of Alpha- and Gamma-Alumina with Copper from Copper Sulphate Baths

Cited by 33 publications

References 8 publications

Electrodeposition of Copper

Electrodeposition of Copper

Annealing behavior of electrodeposited Ni-TiO2 composite coatings

Electrodeposited gold composite coatings

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