Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

Abstract

We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light modulation were developed to assist in achieving an efficient performance of the module. Integration of DFB laser sources within each cell in the matrix was demonstrated as well using wafer bonding between the InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization and gain stack designs were developed. Packaging of these 2D photonic arrays in a chiplet configuration was demonstrated using a vertical integration approach in which the optical interconnect matrix was flip-chip assembled on top of a CMOS mimic chip with 2D vertical fiber coupling. The optical chiplet was further assembled on a substrate to facilitate integration with the multi-chip module of the co-packaged system with a switch surrounded by several such optical chiplets. We summarize the features of the L3MATRIX co-package technology platform and its holistic toolbox of technologies to address the next generation of computing challenges.

High-order topological states using alignment of different bandgaps in 1D superlattices

“…Topological interface states are renowned for their remarkable resilience against disorder, a feature that is critically advantageous for a variety of applications, notably in transport and flawless data communication. 20,38,39 The principles described here, involving the generation of interface states either through band inversion or the combination of different bandgap orders around the same frequency, inherently maintain the central frequency of the bandgap despite potential variations in the unit cell ratio, δ. This robustness to any compositional inaccuracies, or even roughness, is integral to the construction of topological resonators.…”

“…8,[12][13][14] This presents intriguing possibilities, as DBR or distributed feedback (DFB) mirror-based cavities are widely used in photonics applications, enabling high-quality and reliable cavities in various configurations . [15][16][17][18][19][20][21][22][23][24] Consequently, this may offer a promising avenue to seamlessly integrate topological structures with these established photonic technologies.…”

Effects of top layer inhomogeneities on the performance of Fabry-Perot cavities and open resonators based on distributed Bragg reflectors

“…Over the past three decades, such optical cavities have been used in a plethora of applications encompassing quantum technologies, optoelectronics, photonics, and spectroscopy. [1][2][3][4][5][6][7][8][9][10][11][12][13][14] Similarly, acoustic cavities utilizing the same DBR configurations can confine and enhance phononic fields, offering prospects for ultra-high frequency applications. [15][16][17] Furthermore, these cavities were recently used in optomechanics, and as platforms for simulating solid-state physics phenomena.…”

Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer

“…At the same time, the thickness of the fiber also affects the assembly of the interposer to the substrate. In a word, 3D optical modules oriented to data center optical interconnections need to solve the problems of high frequency characteristics of extra-short reach (XSR) Serdes transmission channels, good optical coupling loss characteristics and collaborative design and manufacturing [15,16].…”