Co-design for thermal performance and mechanical reliability of flip chip devices

Ore, Siew Hoon; Poh, S W Edith; Zhu, Wenhui; Yuan, Weiliang; Suthiwongsunthorn, Nathapong

doi:10.1109/icept.2010.5582361

Cited by 2 publications

(2 citation statements)

References 5 publications

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“…With consideration of process, materials and design, we have demonstrated that mold flow simulation is an effective tool to reduce the design-to-implementation cycle time with identification of potential void and melt front imbalance issues. With our increasing range of flip chip products provided, we provide a comprehensive closed-loop solution including moldflow, materials, process, thermal, mechanical and electrical studies [3] to address the rising challenges faced with greater consumer demands for better performance and greater functionalities. moldflow tool support.…”

Section: Discussionmentioning

confidence: 99%

“…The simulation tool is used actively to-fro in conjunction with materials, process and design inputs and considerations, to predict the trend of various factors on moldability upfront to reduce the yield, cost and cycle time as shown in Fig.2. With our increasing range of flip chip products provided, we provide a comprehensive closed-loop solution including moldflow, thermal, mechanical and electrical studies [3] to the rising challenges faced with greater consumer demands for smaller and thinner flip-chip packages with better performance and greater functionalities.…”

Section: Fig1: Rheokinetic Flow Modeling Matrixmentioning

confidence: 99%

See 1 more Smart Citation

Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology

Tamil¹,

Ore²,

Gan³

et al. 2011

International Symposium on Microelectronics

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Increasing challenges are faced to ensure moldability with rapid advances in flip chip technology such as decreasing bump pitch and stand-off height, especially when commercial Moldable Underfill (MUF) is used and in particular, during panel level molding. One key challenge faced is severe void entrapment under the die. Experiments involving a large DOE matrix, which require significant time and process resources, are typically used to solve this issue. 3D flow simulation can be used to optimize the process to reduce defects without doing actual runs. Mold flow simulation can effectively reduce the design-to-implementation cycle time, identifying key problems before actual fabrication. In this paper, 3D mold flow simulation using Moldex3DTM V10 is applied to transfer molding to optimize design and process parameters. This paper proposes and verifies a systematic method that can save computational resources by using 2 steps analysis: simplified panel simulation and single package simulation. The initial step, simplified panel level simulation, is to optimize the process parameters to obtain balanced melt front. The second step is to study on the package level the effect of various package-scale parameters. This analysis provides a prediction of the void location and an insight on the appropriate parameters to minimize void problem. The actual voids location and size from the experiment was captured by SAT machine and short shots were obtained. For final validation, a complete panel-level flow model is built, where the process and design parameters adopted in the actual molding were implemented. The mold filling simulation showed good correlation with the experimental short shots and actual void location. With optimized parameters from the simulation used as guidelines, experimental tests were conducted and the study showed that the simulation is a useful tool to optimize the molding process.

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Section: Discussionmentioning

confidence: 99%

Section: Fig1: Rheokinetic Flow Modeling Matrixmentioning

confidence: 99%