Closure to “Discussion of ‘The Hydrogen Evolution Reaction on Electrodeposited Gold, Nickel, and Zinc Rotating Disk Electrodes’ [P. C. Andricacos and H. Y. Cheh (pp. 838–840, Vol. 128, No. 4)]”

Abstract

not Available.

Cu/Polyimide Multilayer Interconnections Fabricated by Nanoimprint at Every Lithography Process

“…Polyimide patterning is commonly carried out by laser process, photolithography using photo-sensitive polyimide, or pattern transfer by photolithography using standard photoresist and dry etching. However, their processes require sophisticated process steps with long processing time, and multiple alignments resulting in high costs, particularly where 3D interconnection structures are involved [12][13][14]. In addition, it is difficult to fabricate patterns with high resolutions and high-precisions in polyimide films because polyimide is difficult to etch or to dissolve away by a conventional photolithography and etching processes [15][16][17].…”

Electrochemical Processing of Interconnects

“…2. 2,3 Recessed features, including both trenches and vias, are first formed in a thin dielectric layer by lithographic patterning and etching. The entire surface profile is then metallized to enable Cu electroplating and to form a reaction barrier between the dielectric and the Cu interconnects.…”

“…In another favorable turn, additive electroplating also results in post deposition recrystallization that yields high conductivity Cu with the desired bamboo grain structure. 3,6,7 Following feature filling and annealing, the work piece is planarized to remove the overburden. The dual damascene process is then repeated multiple times to build up the desired circuitry, with reports of 9 to 15 layers not uncommon for leadingedge logic chips like that shown in Fig.…”

Influence of Additives and the Effect of Aging in Modifying Surface Topography of Electrodeposited Copper

“…Copper has been used as an interconnect material replacing aluminum because of its low resistivity, high electrical conductivity, and electromigration resistance. [1][2][3][4] Various deposition techniques such as chemical vapor deposition, physical vapor deposition, sputter coating, electroless plating, and electroplating are commonly used. Among these methods, electrodeposition is unique and is a versatile technique that is applied for various types of metal and alloy coatings.…”