Climate-Protective Packaging: Using Basic Physics to Solve Climatic Challenges for Electronics in Demanding Applications

Jacobsen, John Bjerregaard; Krog, Jens Peter; Rimestad, L.; Riis, Annemette; Holm, Anne I. S.

doi:10.1109/mie.2014.2330912

Cited by 39 publications

(18 citation statements)

References 10 publications

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“…Drain openings must have diameters (lateral dimensions) in the range of 3 mm or higher in order to be effective, otherwise, surface tension effects may retain liquid water at the narrow passage. On the other hand, IP4X and higher class enclosures are without drain openings since no opening must allow a solid spherical object of 1 mm diameter to enter [9].…”

Section: Introductionmentioning

confidence: 99%

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Conseil-Gudla

Staliulionis

Jellesen

et al. 2017

IEEE Trans. Compon., Packag. Manufact. Technol.

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Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices from humidity is becoming a critical factor in the system design. The ingress of moisture into typical electronic enclosures has been studied with defined parameters such as openings in the enclosure (drain holes, intentional openings or leak), and sealing and casing material. Related corrosion reliability issues due to humidity build-up have been evaluated using an interdigitated surface insulation resistance (SIR) pattern placed inside the enclosure during exposure. The moisture build-up inside the enclosure has been simulated using an equivalent RC circuit consisting of variables like controlled resistors and capacitors to describe the diffusivity, permeability, and storage in polymers.

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Section: Introductionmentioning

confidence: 99%

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Conseil-Gudla

Staliulionis

Jellesen

et al. 2017

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…As a consequence, the harsh environment drives a range of moisture related failure mechanisms: acceleration of corrosion, leakage currents, alternation of material properties, electrolytic metal migration causing short or open circuits [1][2][3]. Moreover, the importance of moisture problems tends to increase due to miniaturization of electronic devices and lower power consumption [4]. Secondly, there is little known about the moisture load inside electronics and how to predict its lifetime in humid conditions.…”

Section: Introductionmentioning

confidence: 99%

“…There is a number of paths for moisture ingress into enclosures and packages such as cracks, openings, and permeable walls [4][5]. Thus, the objective of this paper is to discuss the moisture ingress through an opening into electronics enclosures when exposed to constant and variable ambient humidity under isothermal conditions.…”

Section: Introductionmentioning

confidence: 99%

Moisture ingress into electronics enclosures under isothermal conditions

Staliulionis¹,

Jabbari²,

Hattel³

2016

AIP Conference Proceedings

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Articles you may be interested inAbstract. The number of electronics used in outdoor environment is constantly growing. The humidity causes about 19 % of all electronics failures and, especially, moisture increases these problems due to the ongoing process of miniaturization and lower power consumption of electronic components. Moisture loads are still not understood well by design engineers, therefore this field has become one of the bottlenecks in the electronics system design. The objective of this paper is to model moisture ingress into an electronics enclosure under isothermal conditions. The moisture diffusion model is based on a 1D quasi-steady state (QSS) approximation for Fick's second law. This QSS approach is also described with an electrical analogy which gives a fast tool in modelling of the moisture response. The same QSS method is applied to ambient water vapour variations. The obtained results are compared to an analytical solution and very good agreement is found.

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“…Unless the enclosure is perfectly sealed and made in truly hermetic materials, moisture may enter it [1]. Moisture can cause corrosion in electronic systems; especially in the presence of ionic contaminants.…”

Section: Introductionmentioning

confidence: 99%

Numerical simulation of transient moisture transfer into an electronic enclosure

Nasirabadi¹,

Jabbari²,

Hattel³

2016

AIP Conference Proceedings

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Abstract. Electronic systems are sometimes exposed to harsh environmental conditions of temperature and humidity. Moisture transfer into electronic enclosures and condensation can cause several problems such as corrosion and alteration in thermal stresses. It is therefore essential to study the local climate inside the enclosures to be able to protect the electronic systems. In this work, moisture transfer into a typical electronic enclosure is numerically studied using CFD. In order to reduce the CPU-time and make a way for subsequent factorial design analysis, a simplifying modification is applied in which the real 3D geometry is approximated by a 2D axial symmetry one. The results for 2D and 3D models were compared in order to calibrate the 2D representation. Furthermore, simulation results were compared with experimental data and good agreement was found.

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Climate-Protective Packaging: Using Basic Physics to Solve Climatic Challenges for Electronics in Demanding Applications

Cited by 39 publications

References 10 publications

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Moisture ingress into electronics enclosures under isothermal conditions

Numerical simulation of transient moisture transfer into an electronic enclosure

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