Chromium Elimination in Surface Engineering

Meyers, Barry; Lynn, Stephen; Jang, Elwin

doi:10.31399/asm.hb.v05.a0001323

Cited by 5 publications

(1 citation statement)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Since the hexavalent chromium used in chromium (Cr) electroplating was found to cause cancer in human body [1], physical vapor deposition(PVD) techniques such as spray, sputtering, ion implantation, and ion plating of many hard coating materials have been widely investigated as alternative deposition techniques. The hard coating materials include CrN, Cr 2 O 3 , CrC,TiN, TiCN, TiCrN, Al 2 O 3 -TiO 2 , Fe-Cr alloy, Zn-Ni alloy.…”

Section: Introductionmentioning

confidence: 99%

Reactive Sputter Deposition of WC<sub>x</sub> Films for Replacing Hexavalent Chromium

Park

Kang

Kim

et al. 2005

MSF

View full text Add to dashboard Cite

This paper investigates the reactive sputter deposition of tungsten carbide (WCx) films for replacing hexavalent chromium which was found to cause cancer in human body. The deposition rate of the films was proportional to rf-power and inversely proportional to the CH4 content in the sputtering gas. The hardness of the WCx coatings increased as the rf-power increased. The highest hardness was obtained at the CH4 concentration of 10 vol.% in the sputtering gas. The hardness of the WCx film deposited under optimal conditions was far higher than that of the electroplated chromium film although the corrosion-resistance of the former was slightly inferior to that of the latter. Considering all these experimental results, it may be concluded that the reactive sputterdeposition of WCx coatings can be effectively applied to the parts with complex geometries as an alternative to chromium electroplating.

show abstract

Section: Introductionmentioning

confidence: 99%

Reactive Sputter Deposition of WC<sub>x</sub> Films for Replacing Hexavalent Chromium

Park

Kang

Kim

et al. 2005

MSF

View full text Add to dashboard Cite

show abstract

Crystallisation and Phase Transformation Behaviour of Electroless Nickel-Phosphorus Deposits and Their Engineering Properties

Keong

Sha

2002

Surface Engineering

View full text Add to dashboard Cite

The crystallisation and phase transformation behaviour of electroless Ni-P deposits during thermal processing have a vital role in determining their material properties. Conflicting results have been reported for the correlation of crystallisation and phase transformation behaviour with deposit composition and thermal processing, and hence microstructure and material properties. These variations are believed to be caused by variations in factors including plating conditions, substrate composition and surface preparation, and testing and measuring techniques. The mechanism of electroless Ni-P plating is discussed briefly and the literature on the effect of crystallisation and phase transformation behaviour on the microstructure and material properties of electroless Ni-P deposits is critically reviewed. A comparison is made with other commonly used engineering deposits such as electroplated nickel and hard chromium. The advantages, limitations, and development of electroless Ni-P are outlined and the use of heat treatment to tailor properties for specific industrial applications are described. Finally, the challenges this technology faces in the future are considered.

show abstract

Effects of sputtering power on mechanical properties of Cr films deposited by magnetron sputtering

Kim¹,

Park²,

Lee³

et al. 2008

Materials Science and Technology

View full text Add to dashboard Cite

Chromium (Cr) films were deposited on plain carbon steel sheets by dc and rf magnetron sputtering as well as by electroplating. Effects of dc or rf sputtering power on the deposition rate and properties such as, hardness, adhesion strength, surface roughness and corrosion resistance of the Cr films were investigated. X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microcopy (SEM) analyses were performed to investigate the crystal structure, surface roughness, thickness of the Cr films. Salt fog tests were used to evaluate the corrosion resistance of the samples. The deposition rate, hardness and surface roughness of the Cr film deposited by either dc or rf sputtering increase with the increase in sputtering power but the adhesion strength is nearly independent of the sputtering power. The deposition rate, hardness and adhesion strength of the Cr film deposited by dc sputtering are higher than those of the Cr film deposited by rf sputtering, but rf sputtering offers smoother surface and higher corrosion resistance. The sputter deposited Cr film is harder and has a smoother surface than the electroplated one. The sputter deposited Cr film also has higher corrosion resistance than the electroplated one, which may be attributed to the smoother surface of the sputter deposited film.

show abstract

Chromium Elimination in Surface Engineering

Cited by 5 publications

References 0 publications

Reactive Sputter Deposition of WC<sub>x</sub> Films for Replacing Hexavalent Chromium

Reactive Sputter Deposition of WC<sub>x</sub> Films for Replacing Hexavalent Chromium

Crystallisation and Phase Transformation Behaviour of Electroless Nickel-Phosphorus Deposits and Their Engineering Properties

Effects of sputtering power on mechanical properties of Cr films deposited by magnetron sputtering

Contact Info

Product

Resources

About