2011 IEEE SENSORS Proceedings 2011
DOI: 10.1109/icsens.2011.6126924
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Chip to wafer temporary bonding with self-alignment by patterned FDTS layer for size-free MEMS integration

Abstract: In this paper, we present a low-cost and rapid selfalignment process for temporary bonding of MEMS chip onto carrier wafer for size-free MEMS-IC integration. For the first time, a hydrophobic self-assembled monolayer (SAM), FDTS (CF 3 (CF 2 ) 7 (CH 2 ) 2 SiCl 3 ), was successfully patterned by lift-off process on an oxidized silicon carrier wafer. Small volume of H 2 O (~l/cm 2 ) was then dropped and spread on the non-coated hydrophilic SiO 2 surface for temporary bonding of MEMS chip. Our results demonstrate… Show more

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Cited by 8 publications
(5 citation statements)
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“…Computational fluid dynamics (CFD) simulations facilitate the understanding and prediction of such two-phase flows for flexible and accurate fluid motion and position control; the result can be used to optimally design microfluidic devices, machineries, and fabrication processes (2)- (4) . It is often difficult to experimentally observe such flows, measure the flow variables (velocity, pressure, etc.)…”
Section: Introductionmentioning
confidence: 99%
“…Computational fluid dynamics (CFD) simulations facilitate the understanding and prediction of such two-phase flows for flexible and accurate fluid motion and position control; the result can be used to optimally design microfluidic devices, machineries, and fabrication processes (2)- (4) . It is often difficult to experimentally observe such flows, measure the flow variables (velocity, pressure, etc.)…”
Section: Introductionmentioning
confidence: 99%
“…Vapour deposition of the FDTS fine pattern on the SiO 2 /Si substrate was developed in our previous study and the details were published elsewhere [12]. In this work, sputtered Pt/Ti with a thickness of 200/50 nm was used as the PZT bottom electrode.…”
Section: Methodsmentioning
confidence: 99%
“…Perfluorodecyltrichlorosilane (FDTS, CF 3 (CF 2 ) 7 (CH 2 ) 2 SiCl 3 ) is a long chain perfluoronated silane self‐assembled monolayer (SAM) for producing hydrophobic surfaces, which have an ultra‐low thickness of only several nanometers and easily decompose by deep‐UV light or O 2 plasma treatment. A lift‐off process of FDTS fine pattern was developed in our previous study for rapid and highly accurate chip to wafer self‐alignment and temporary bonding [12]. In this work, a lift‐off processed FDTS fine pattern was introduced to create hydrophobic surfaces on the Pt/Ti/SiO 2 /Si substrate, where the interaction between the following spin‐coated sol–gel PZT precursor and the Pt/Ti bottom electrode was blocked during the PZT high‐temperature annealing.…”
Section: Introductionmentioning
confidence: 99%
“…pump, inkjet, reactor, liquid lens, etc.) and micro-electro-mechanical-systems (MEMS) device fabrication processes can be optimally designed [2][3][4][5][6][7][8].…”
Section: Introductionmentioning
confidence: 99%