2014
DOI: 10.1088/0960-1317/24/9/097001
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‘Chip-olate’ and dry-film resists for efficient fabrication, singulation and sealing of microfluidic chips

Abstract: This paper describes a technique for high-throughput fabrication and efficient singulation of chips having closed microfluidic structures and takes advantage of dry-film resists (DFRs) for efficient sealing of capillary systems. The technique is illustrated using 4-inch Si/SiO 2 wafers. Wafers carrying open microfluidic structures are partially diced to about half of their thickness. Treatments such as surface cleaning are done at wafer-level, then the structures are sealed using low-temperature (45 °C) lamina… Show more

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Cited by 22 publications
(9 citation statements)
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References 43 publications
(48 reference statements)
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“…We called this technique the ''chip-olate'' process because the singulation of sealed chips from the wafer is as easy as breaking a chocolate bar. We also demonstrated the compatibility of DFR-based sealing technique with capillary-driven microfluidic chips [139] and immunoassays having patterned protein arrays [140].…”
Section: New Prototyping Techniques Providing a Paradigm Shift For Sementioning
confidence: 99%
“…We called this technique the ''chip-olate'' process because the singulation of sealed chips from the wafer is as easy as breaking a chocolate bar. We also demonstrated the compatibility of DFR-based sealing technique with capillary-driven microfluidic chips [139] and immunoassays having patterned protein arrays [140].…”
Section: New Prototyping Techniques Providing a Paradigm Shift For Sementioning
confidence: 99%
“…The lateral walls of microchannels were 15 μm high and patterned in SU-8 using a standard photolithography process. Then, chips were partially diced using the “Chip-olate” process 56 and sealed by lamination using a dry fil resist (DF-1050, EMS Inc., USA).…”
Section: Methodsmentioning
confidence: 99%
“…35 A fabricated wafer after partial dicing and wafer-level cleaning steps is shown in Figure 2b. Following the partial dicing step (about 300 µm cutting depth), the microfluidic channels were sealed by wafer-level lamination (at 50 °C) of a DF-1050 DFR (Engineered Materials Systems Inc., USA) pre-patterned by an electronic craft cutter.…”
Section: Methodsmentioning
confidence: 99%