ChemInform Abstract: ELECTROLESS DEPOSITION OF NICKEL‐BORON ALLOYS, MECHANISM OF PROCESS, STRUKTURE AND SOME PROPERTIES OF DEPOSITS

Gorbunova, K.M.; Ivanov, M. V.; Моисеев, В. П.

doi:10.1002/chin.197329048

Cited by 3 publications

(4 citation statements)

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“…There have been several propositions regarding the reaction mechanism of electroless Ni-B coatings but one of the mechanisms proposed by Gorbunova, Ivanov, and Moiseev (1973) is well supported by experimental evidence. The proposed scheme for the reaction mechanism of nickel boron plating consists of mainly three steps:…”

Section: Experimental Details Coating Proceduresmentioning

confidence: 98%

Roughness Optimization of Electroless Ni-B Coatings Using Taguchi Method

Das

Sahoo

2011

International Journal of Manufacturing, Materials, and Mechanical Engineering

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In this paper, the authors present an experimental study of roughness characteristics of electroless Ni-B coatings and optimization of the coating process parameters based on L27 Taguchi orthogonal design. Three coating process parameters are considered viz. bath temperature, reducing agent concentration, and nickel source concentration. It is observed that concentration of reducing agent together with bath temperature play a vital role in controlling the roughness characteristics of the coatings. The analysis yields the optimum coating parameter combination for minimum roughness. A reduction of about 15% is observed in roughness at the optimal condition compared to the initial condition. The microstructure, composition, and the phase content of the coating are also studied with the help of scanning electron microscopes energy dispersive X-ray analysis, and X-ray diffraction analysis, respectively.

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Section: Experimental Details Coating Proceduresmentioning

confidence: 98%

Roughness Optimization of Electroless Ni-B Coatings Using Taguchi Method

Das

Sahoo

2011

International Journal of Manufacturing, Materials, and Mechanical Engineering

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“…It was justified that the electroless deposition of Ni-P and Ni-B alloys could be successfully used in piezoengineering, microelectronics and so on (1)(2)(3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18)(19)(20). For development of the optimum technology, we improved the entire cycle of the metallization process: the preliminary treatment of various substrates (sensitization and activation), the composition of solutions and the parameters of electroless deposition, the parameters of heat treatment after deposition, the conditions of photolithography, the selective etching processes, etc.…”

Section: Some Data On the Mechanism Of Activation And Sensitizationmentioning

confidence: 99%

“…The advantages of electroless deposition of metals and alloys are the following: a possibility of obtaining the coating of uniform thickness on arbitrary shaped-surfaces, good solderability, sufficient chemical resistance, high hardness and wear resistance, a possibility of varying the mechanical properties and electrical conductivity of the films in a wide range. Hence, this opens up new avenues for wide application of electrolessly deposited films (1)(2)(3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18)(19)(20).…”

Section: Introductionmentioning

confidence: 99%

Electroless Metallization of Nano-Sized Particles, Composites Fabrication

Khoperia¹,

Zedginidze²

2008

ECS Trans.

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New data on the competitive nanotechnologies for fabrication of fine-grained powder-like particles, films, bulk materials, nanocomposites, devices for microelectronics, nanoelectronics, photonics and photocatalysis are presented. The proposed nanotechnologies for electronics are much more advantageous and simpler than other expensive and complicated methods such as e-beam lithography, X-ray lithography or production of the devices using light phase shift photomasks. The mechanism of sensitization and activation was established. The proposed methods of metallization are widely used in electronics and instrument-making. As a result, Au, Ag and Pd were adequately replaced with the alloys of non-precious metals, the use of toxic substances was eliminated and the technology was significantly simplified.

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“…At adding HCl (1 milliliter of concentrated acid per gram of PdCl 2 .2H 2 O), chloropalladic acid is formed according to the reaction: 2 HCl + PdCl 2 = H 2 PdCl 4 , [6] which affects favorably the activation process.…”

Section: The Mechanism Of Reactions Of Hypophosphite Oxidation and El...mentioning

confidence: 99%

Electroless Deposition of Metals and Alloys for Micropelectronics, Nanoelectronics, Piezoengineering and Composites Fabrication

Khoperia¹,

Zedginidze²

2008

ECS Trans.

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ChemInform Abstract: ELECTROLESS DEPOSITION OF NICKEL‐BORON ALLOYS, MECHANISM OF PROCESS, STRUKTURE AND SOME PROPERTIES OF DEPOSITS

Abstract: Ni‐B‐Legierungen wurden stromlos aus Lösungen abgeschieden, die ein Ni‐Salz (NiCIQ ), NaBH4 als Reduktionsmittel, NaOH, einen Komplexbildner ( ;z.B. Äthylendiamin) und einen Stabilisator ( ;z.B. TlNO3, PbCl2 oder 2‐Mercaptobenzothiazol) enthalten.

Cited by 3 publications

References 1 publication

Roughness Optimization of Electroless Ni-B Coatings Using Taguchi Method

Roughness Optimization of Electroless Ni-B Coatings Using Taguchi Method

Electroless Metallization of Nano-Sized Particles, Composites Fabrication

Electroless Deposition of Metals and Alloys for Micropelectronics, Nanoelectronics, Piezoengineering and Composites Fabrication

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