“…E-mail: nadim.darwish@ curtin.edu.au application, SAMs could replace SiO 2 as the insulating material in eld-effect transistors and other devices, providing better structural and chemical control, 27,[31][32][33] leading even to biomedical applications. 34 Devices in which the interface forms a critical component 10 include: quantum-dot photonics, 35 light harvesting and usage, 36,37 photoluminescence, 38 general electrochemical applications 39 including sensing, 40 polymer engineering, 41 hydrophobicity, 42 general electrochemical sensors, 43 bioimaging, biosensing, and cancer treatment, 44,45 as well as molecular-electronics applications. 26,39,[46][47][48][49][50] Mostly the strategies used for making covalent bonds to silicon 51 have involved conditions considered harsh for silicon engineering, including: radical initiators, 30,52,53 Lewis acids, 54 Grignard reagents, 29,55 electrograing, 56 and microwave 57 or UV-visible irradiation, [58][59][60] with many processes also requiring signicant heating.…”