1990
DOI: 10.1016/0040-6090(90)90154-6
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Chemical vapour deposition of SiC layers from a gas mixture of CH3SiCl3+H2+Ar

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Cited by 9 publications
(19 citation statements)
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“…The microstructure, phase content, and morphology of the deposit are significantly affected by deposition temperature, pressure, and initial gas composition. [25][26][27][28][29][30][31][32] The SiC grain size increases with increasing deposition temperature 13,31 or pressure, 29,30 but with decreasing H 2 /MTS ratio. 29,32 In general, a lower deposition temperature 16,28,33,34 or a greater pressure 28,32,34 is favorable for Si co-deposition with SiC.…”
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“…The microstructure, phase content, and morphology of the deposit are significantly affected by deposition temperature, pressure, and initial gas composition. [25][26][27][28][29][30][31][32] The SiC grain size increases with increasing deposition temperature 13,31 or pressure, 29,30 but with decreasing H 2 /MTS ratio. 29,32 In general, a lower deposition temperature 16,28,33,34 or a greater pressure 28,32,34 is favorable for Si co-deposition with SiC.…”
mentioning
confidence: 99%
“…[25][26][27][28][29][30][31][32] The SiC grain size increases with increasing deposition temperature 13,31 or pressure, 29,30 but with decreasing H 2 /MTS ratio. 29,32 In general, a lower deposition temperature 16,28,33,34 or a greater pressure 28,32,34 is favorable for Si co-deposition with SiC. Si is also found to coexist with SiC at relatively high H 2 /MTS ratios.…”
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confidence: 99%
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