Chemical modifications in femtosecond ultraviolet (248 nm) excimer laser radiation-processed polyimide

Adhi, K. P.; Owings, Roger L.; Railkar, T. A.; Brown, W.D.; Malshe, Ajay P.

doi:10.1016/j.apsusc.2003.10.034

Cited by 29 publications

(17 citation statements)

References 10 publications

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“…One particular advantage of applying an excimer laser is that its non-thermal effects make it suitable for machining of polymers. The use of a pulsed excimer laser for the ablation of polyimides has attracted considerable attention in recent years because polyimide films are widely used as substrates for inkjet printer head, flexible printed circuits, motor slot liners, transformer and capacitor insulators, dielectric layers in multi-chip modules, and micro-and nano-electromechanical systems (27)(28)(29)(30)(31).…”

Section: Introductionmentioning

confidence: 99%

Dielectric Behavior of Thin Films made from poly(oxadiazole-naphthylimide)s

Damaceanu¹,

Rusu²,

Musteata³

et al. 2010

Soft Materials

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Oxadiazole-containing poly(naphthylimide)s were prepared by polycondensation reaction and their solid-state properties were investigated. Flexible films having good mechanical properties were made therefrom. The tougher polymer films were the subject of electrical insulating properties measurements. The dielectric constant values, measured at room temperature and in the frequency domain of 1 Hz-1 MHz, are in the range of 2.63-3.24, being lower or comparable with those of Kapton HN measured under the same conditions. The dielectric loss values are low, in the same range with those of Kapton HN. The dielectric spectroscopy data showed distinct subglass transitions for these polymers: γ relaxations with activation energies of 35 and 46 kJ/mol, and a β relaxation with the activation energy of 86 kJ/mol.

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Section: Introductionmentioning

confidence: 99%

Dielectric Behavior of Thin Films made from poly(oxadiazole-naphthylimide)s

Damaceanu¹,

Rusu²,

Musteata³

et al. 2010

Soft Materials

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Section: Introductionmentioning

confidence: 99%

“…Excimer laser ablation of polyimides has attracted considerable attention because these polymers possess outstanding key properties, such as thermooxidative stability, high mechanical strength, high modules, excellent electrical and optical properties, and superior chemical resistance, and are ideal for a variety of applications in the electrical and electronics industries. Polyimide films are widely used as substrates for flexible printed circuits, motor slot liners, transformer and capacitor insulators, dielectric layers in multichip modules, and micro-and nanoelectromechanical systems~Hergenrother, 2003; Adhi et al, 2004!. Since the commercialization of Kapton polyimide~a polyimide based on pyromellitic dianhydride and 4,4 'diaminodiphenylether!, an impressive variety of polyimides has been synthesized~Sroog, 1996; Hamciuc et al, 1997;Schulz et al, 2003;Damaceanu et al, 2009;Sava et al, 2010!. The direct structuring or laser ablation of polyimides by excimer lasers was first described approximately 25 years ago~Andrew et al, 1983;Srinivasan & Braren, 1984!. Laser ablation studies clearly showed that this method caused clean etching of the material with micron-size precision.…”

Section: Introductionmentioning

confidence: 99%

KrF Pulsed Laser Ablation of Thin Films Made from Fluorinated Heterocyclic Poly(Naphthyl-Imide)s

et al. 2012

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Among the many aspects of laser ablation, development of conical structures induced by excimer laser radiation on polyimide surfaces has been thoroughly investigated. Because the mechanisms that produce these surface textures are not fully understood, two theories, photochemical bond breaking and thermal reaction, have been introduced. Here we present the first study of ultraviolet laser ablation behavior of thin films made from fluorinated poly(naphthyl-imide)s containing oxadiazole rings and the investigation of the mechanism of cone-like structure formation at two laser fluences, 57 and 240 mJ/cm(2). The morphology of thin films before and after laser ablation was studied by using various spectroscopy techniques such as Fourier transform infrared spectroscopy, time-resolved emission and X-ray photoelectron spectroscopy, atomic force microscopy, and contact angle measurements. All of the data suggest impurities shielded at low fluence radiation (57 mJ/cm(2)) and a radiation hardening process at high value fluence (240 mJ/cm(2)), which are proposed as the main mechanisms for laser ablation of our polyimide films, and we bring evidence to support them.

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“…The development of novel engineered materials involving the exposure of PI to high energy ionizing radiation is an actively evolving engineering field where the efforts of many researchers are focused. Reports on PI irradiation with electron beams of different energy and exposure to VUV photons (usually in the form of laser irradiation) to improve PI's radiation resistance (e.g., [175]) and surface properties (e.g., [19,[176][177][178][179][180][181]) have been published. Moreover, efforts were undertaken to improve the atomic oxygen (AO) erosion resistance of PI for low Earth orbit (LEO) applications.…”

Section: Discussionmentioning

confidence: 99%

Review of Radiation-Induced Effects in Polyimide

Plis¹,

Engelhart²,

Cooper

et al. 2019

Applied Sciences

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Polyimide (PI, Kapton-H®) films are widely utilized in the spacecraft industry for their insulating properties, mechanical durability, light weight, and chemical resistance to radiation. Still PI materials remain exposed to a combination of high-energy electrons, protons, and ultraviolet (UV) photons, particles primarily responsible for radiation-induced damage in geosynchronous Earth orbit (GEO), which drastically change PI’s properties. This work reviews the effect of electron, proton, and UV photon irradiation on the material properties (morphology, absorption, mechanical properties, and charge transport) of PI. The different damaging mechanisms and chemical consequences that drive changes in the material properties of PI caused by each individual kind of irradiation will be discussed in detail.

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Chemical modifications in femtosecond ultraviolet (248 nm) excimer laser radiation-processed polyimide

Cited by 29 publications

References 10 publications

Dielectric Behavior of Thin Films made from poly(oxadiazole-naphthylimide)s

Dielectric Behavior of Thin Films made from poly(oxadiazole-naphthylimide)s

KrF Pulsed Laser Ablation of Thin Films Made from Fluorinated Heterocyclic Poly(Naphthyl-Imide)s

Review of Radiation-Induced Effects in Polyimide

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