2001
DOI: 10.1016/s0141-3910(01)00092-1
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Chemical modification of dicyclopentadiene-based epoxy resins to improve compatibility and thermal properties

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Cited by 46 publications
(18 citation statements)
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“…In transitioning to the formulation prepared using the lowest molecular weight siloxane pre‐polymer (1000–1100 g mol −1 ), SiCE‐H11, T d is shifted upwards by nearly 100 °C and is assigned to the increased thermochemical stability arising from the incorporation of the siloxane pre‐polymer . Similarly, the char yield also increases to about 44% as a result of the siloxane pre‐polymer . The SiCE‐H21 elastomer shows a further increase in T d by about 60 °C and the char yield increases to about 70% with respect to SiCE‐H11.…”
Section: Resultsmentioning
confidence: 99%
“…In transitioning to the formulation prepared using the lowest molecular weight siloxane pre‐polymer (1000–1100 g mol −1 ), SiCE‐H11, T d is shifted upwards by nearly 100 °C and is assigned to the increased thermochemical stability arising from the incorporation of the siloxane pre‐polymer . Similarly, the char yield also increases to about 44% as a result of the siloxane pre‐polymer . The SiCE‐H21 elastomer shows a further increase in T d by about 60 °C and the char yield increases to about 70% with respect to SiCE‐H11.…”
Section: Resultsmentioning
confidence: 99%
“…The exothermic curing peak obtained on the DSC scan for SH bleed. This peak can tell us that second step of polymerization is not complete and after additional heating of the pDCPD, more crosslinking between polymer chains can be created .…”
Section: Resultsmentioning
confidence: 99%
“…One of the most commonly used group of curing agents for liquid epoxy resins are aliphatic [9][10][11][12][13][14], or aromatic [15][16][17][18] amines or imidazole derivatives [19,20]. Recently, among frequently studied modifiers of epoxy polymers are silicone containing compounds, including various siloxanes or silsesquioxanes [21][22][23][24][25][26][27][28][29][30]. The effect of two low-molecular siloxanes: 1,3-Bis(glycidyloxypropyl)-1,1,3,3-tetramethyldisiloxane and 1,3-bis(aminopropyl)-1,1,3,3-tetramethyldisiloxane on performance properties of liquid bisphenol A epoxy resin cured with triethylenetetramine were reported in our previous paper [25].…”
Section: Introductionmentioning
confidence: 99%
“…The appropriate tool to study the problem is the thermal analysis, in particular the conventional or temperaturemodulated differential scanning calorimetry (DSC). The DSC study can be carried out in a dynamic [9,[31][32][33][34][35][36][37][38] or isothermal mode [22,[39][40][41].…”
Section: Introductionmentioning
confidence: 99%