1987
DOI: 10.1007/bf01233125
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Chemical etching of (100) GaAs in a sulphuric acid-hydrogen peroxide-water system

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Cited by 21 publications
(13 citation statements)
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“…Gallium phosphide films on silicon were patterned by photolithography and the GaP was etched with a 5:1:1 mixture of deionized water, 97% sulfuric acid, and 30% hydrogen peroxide, similar to approaches previously used for GaAs etching 27 . Etch completion was judged by eye and confirmed by dipping in buffered hydrofluoric acid, owing to the hydrophobic nature of clean Si, whereas Si covered by GaP remained hydrophilic.…”
Section: Methodsmentioning
confidence: 99%
“…Gallium phosphide films on silicon were patterned by photolithography and the GaP was etched with a 5:1:1 mixture of deionized water, 97% sulfuric acid, and 30% hydrogen peroxide, similar to approaches previously used for GaAs etching 27 . Etch completion was judged by eye and confirmed by dipping in buffered hydrofluoric acid, owing to the hydrophobic nature of clean Si, whereas Si covered by GaP remained hydrophilic.…”
Section: Methodsmentioning
confidence: 99%
“…The etching bath is constituted by (1) an oxidant (Br 2 /HNO 3 /H 2 O 2 that oxidizes the surface on several nanometers, (2) an acid component (H 2 SO 4 /H 3 PO 4 /HF/HCl/citric acid/HNO 3 or a base (NH 4 OH/NaOH) that allows the dissolution of oxidized surface, and eventually (3) a solvent (H 2 O) enabling a better mobility of particles and huge variations in dissolution rates. 20 21 The whole process of etching is the following [22][23][24][25] (Fig. 1): -adsorption of oxidative agent and diffusion through the oxidized native layer towards the interface -oxidation reaction between the oxidative agent and the atoms present at the surface of the material -adsorption of the acid or base components in the oxidative native layer -solubilisation of the oxide formed (by a complex formation under the effect of the acid or the base component) -desorption and evacuation of dissolved complexes.…”
Section: State-of-the-artmentioning
confidence: 99%
“…1, step 2). The surface topography of the material will strongly depend on the type of reaction, that is either dominated by the diffusion or the reaction process: [21][22][23][24][25][26][27] -In the case of a diffusion limited process, only the diffusion of chemical species limits the global reaction rate. If the repartition of species is homogeneous near the surface, the etch rate will be the same for any material crystal plate orientations: the etching follows an isotropic process and the surface is polished.…”
Section: State-of-the-artmentioning
confidence: 99%
“…Microcantilevers were released via back-side bulk micromachining in two solutions. The H 2 SO 4 :H 2 O 2 :H 2 O mixture [11,12] was used as a fast etchant which was followed by a finer H 3 PO 4 :H 2 O 2 :H 2 O (1:2:8) etchant [13,14]. The experiments were performed with various compositions, un-or stirred, in the temperature range of 25-30°C.…”
Section: Experimental Partmentioning
confidence: 99%