Boron carbon nitride (BCN) films were prepared by reactive magnetron sputtering from a B 4 C target and deposited to make metal-insulator-metal (MIM) sandwich structures using aluminum as the top and bottom electrodes. BCN films were deposited at various N 2 /Ar gas flow ratios, substrate temperatures. The electrical characterization of the MIM devices includes capacitance vs. voltage (C-V), current vs voltage, and breakdown voltage characteristics. The above characterizations were performed as a function of deposition parameters. By varying the nitrogen concentration in the deposited films and substrate deposition temperatures, the electrical properties of BCN can be tuned accordingly. BCN films having dielectric constant as low as 2.13 with high dielectric breakdown strength of 3.4 MV/cm and resistivity of 3 × 10 12 .cm were achieved. Inter layer dielectric (ILD) materials play the role of isolating electrically conducting and semiconducting features and films.1 The interconnect delay (τ = R × C) due to constant shrinking of device size can be reduced not only by the resistance of the conductor but also by decreasing the capacitance of ILD. A wiring metal with low resistivity and a high quality insulating film with a low dielectric constant may lead to a reduction of the wiring capacitance. There exist atomic bonding similarities amongst boron, carbon, and nitrogen that allow formation of compounds with a wide compositional range. ILD is made up of smaller atoms/ions of C, B which has comparatively lower polarizability and thus has lower dielectric constant.2 BCN compounds have been expected to combine the excellent properties of B 4 C, BN and C 3 N 4 , with their properties adjustable, depending on composition and structure.3 The electrical properties of BCN compounds are thought to be intermediate between those of semi metallic graphite and insulating hexagonal-BN (h-BN).4,5 The boron-carbonnitrogen phase diagram contains interesting phases, such as diamond, graphite, fullerene, cubic-BN, B 4 C and there is also a hypothetical C 3 N 4 . This ternary alloy is expected to combine properties of diamond, cubic boron nitride, tetragonal amorphous carbon and boron carbide.6 Also, the ability to control the bandgap (Eg) by changing the atomic composition and structure makes them suitable for the application in electronic and photonic devices. 7,8 As graphite is semi metallic and h-BN is insulating (bandgap >3.8 eV), it is expected that such a hybrid between semi metallic graphite and insulating h-BN may show adjusted semiconductor properties.9 Dense (pore-free) BCN films with a low dielectric constant in the range of 1. 19,20 Also, shock wave compression or high pressure/high temperature techniques (HP/HT) have been used. The BCN films with different compositions can be obtained by varying the power to the composite target in dual target sputtering.11 Pan et al. prepared BCN films by PLD from a sintered B 4 C target. The films prepared were found to be smooth and adhered well to the substrate. They also observed th...