1995
DOI: 10.1016/0925-9635(94)05301-4
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Chemical and morphological modifications of silicon wafers treated by ultrasonic impacts of powders: consequences on diamond nucleation

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Cited by 28 publications
(10 citation statements)
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“…Since the roughness of the substrate supports nucleation, the substrates were abraded using diamond powder with an average grain diameter of approximately 10 mm, and subsequently cleaned using ultrasonic waves in order to avoid the remains of the diamond particles. [24,25] For each sample we studied the free growth surface, the nucleation surface (interface to substrate), and the cross-section (Fig. 1).…”
Section: Methodsmentioning
confidence: 99%
“…Since the roughness of the substrate supports nucleation, the substrates were abraded using diamond powder with an average grain diameter of approximately 10 mm, and subsequently cleaned using ultrasonic waves in order to avoid the remains of the diamond particles. [24,25] For each sample we studied the free growth surface, the nucleation surface (interface to substrate), and the cross-section (Fig. 1).…”
Section: Methodsmentioning
confidence: 99%
“…The methane concentration in the hydrogen feeding flow was 1%. Since the microscopic roughness of the substrate promotes nucleation [35,36], the substrate was polished using diamond powder and cleaned in an ultrasonic bath. During the nucleation phase, a hydrogen feeding flow of 2.5% methane was applied for 15 min at 950 • C (±20 • C).…”
Section: Diamond Film Synthesismentioning
confidence: 99%
“…The N 2 / CH 4 ratios in the feeding flow were set to 0.5%, 1.5%, 2.5%, and 3.5%, respectively. Since the roughness of the substrate promotes nucleation, 14,15 the substrates were polished using diamond powder and cleaned in an ultrasonic bath. During the nucleation phase, a hydrogen feeding flow of 2.5% methane was applied for 15 min at 950°C ͑Ϯ20 K͒.…”
mentioning
confidence: 99%