1993
DOI: 10.1109/22.210245
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Characterizing the cylindrical via discontinuity

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Cited by 16 publications
(2 citation statements)
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“…In [3], the capacitance of a via through a thick ground plane is determined, and in [4] the analysis is extended to account for the connecting traces. A finite-difference time-domain (FDTD) method is used to determine a lumped-element via model in [5], [6]. In [7], the via capacitance is determined from an integral-equation method whose Green's function accounts for the dielectric.…”
Section: Introductionmentioning
confidence: 99%
“…In [3], the capacitance of a via through a thick ground plane is determined, and in [4] the analysis is extended to account for the connecting traces. A finite-difference time-domain (FDTD) method is used to determine a lumped-element via model in [5], [6]. In [7], the via capacitance is determined from an integral-equation method whose Green's function accounts for the dielectric.…”
Section: Introductionmentioning
confidence: 99%
“…Monolithic Microwave Integrated Circuits (MMIC) and in high-speed digital circuits. The FDTD technique has been used to model microstrip interconnects [5,6], vias [7], bends [8,9] and discontinuities in general [10].…”
mentioning
confidence: 99%