Characterizing junction-to-case thermal resistance and its impact on end-use applications

Galloway, Jesse; Bhopte, Siddharth; Nelson, Cameron

doi:10.1109/itherm.2012.6231576

Cited by 11 publications

(1 citation statement)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This variation quickly grew when the composition of the cold plate and the heat transfer coefficient of the measurement environment were changed. A similar study with associated simulation experiment is presented in Reference [29].…”

Section: Case Study: Comparison Of R Thjc Values Gained From Differenmentioning

confidence: 87%

On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices

et al. 2020

View full text Add to dashboard Cite

Traditionally the thermal behavior of power devices is characterized by temperature measurements at the junction and at accessible external points. In large modules composed of thin chips and materials of high thermal conductivity the shape and distribution of the heat trajectories are influenced by the external boundary represented by the cooling mount. This causes mediocre repeatability of the characteristic RthJC junction to case thermal resistance even in measurements at the same laboratory and causes very poor reproducibility among sites using dissimilar instrumentation. The Transient Dual Interface Methodology (TDIM) is based on the comparison of measured structure functions. With this method high repeatability can be achieved although introducing severe changes into the measurement environment is the essence of this test scheme. There is a systematic difference between thermal data measured with TDIM method and that measured with temperature probes, but we found that this difference was smaller than the scatter of the latter method. For checking production stability, we propose the use of a structure function-based Rth@Cth thermal metric, which is the thermal resistance value reached at the thermal capacitance belonging to the mass of the package base. This metric condenses the consistency of internal structural elements into a single number.

show abstract

Section: Case Study: Comparison Of R Thjc Values Gained From Differenmentioning

confidence: 87%

On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices

et al. 2020

View full text Add to dashboard Cite

show abstract

Semi-in-situ thermal transport characterization of thermal interface materials through a low-frequency thermoreflectance technique

Li,

Shi

et al. 2025

Measurement

View full text Add to dashboard Cite

A Guide for Accurate and Repeatable Measurement of the R_{TH, JC} of SiC Packages

Knoll

DiMarino

Buttay

2022

2022 IEEE Energy Conversion Congress and Exposition (ECCE)

View full text Add to dashboard Cite

Characterizing junction-to-case thermal resistance and its impact on end-use applications

Cited by 11 publications

References 2 publications

On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices

On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices

Semi-in-situ thermal transport characterization of thermal interface materials through a low-frequency thermoreflectance technique

A Guide for Accurate and Repeatable Measurement of the R_{TH, JC} of SiC Packages

Contact Info

Product

Resources

About

Characterizing junction-to-case thermal resistance and its impact on end-use applications

Cited by 11 publications

References 2 publications

On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices

On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices

Semi-in-situ thermal transport characterization of thermal interface materials through a low-frequency thermoreflectance technique

A Guide for Accurate and Repeatable Measurement of the RTH, JC of SiC Packages

Contact Info

Product

Resources

About

A Guide for Accurate and Repeatable Measurement of the R_{TH, JC} of SiC Packages