2019
DOI: 10.1007/s40964-019-00098-2
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Characterization of the anisotropic thermal conductivity of additively manufactured components by fused filament fabrication

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Cited by 42 publications
(26 citation statements)
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“…The effective thermal conductivity of the samples was characterized using an apparatus developed in [9] which is based upon a modified guarded hot plate technique similar to ASTM C177 [26]. A schematic of this apparatus is shown in Figure 3.…”
Section: Thermal Conductivity Measurementsmentioning
confidence: 99%
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“…The effective thermal conductivity of the samples was characterized using an apparatus developed in [9] which is based upon a modified guarded hot plate technique similar to ASTM C177 [26]. A schematic of this apparatus is shown in Figure 3.…”
Section: Thermal Conductivity Measurementsmentioning
confidence: 99%
“…The entire assembly was encased with silica aerogel insulation which has a thermal conductivity of 0.014 W/mK. Additional details regarding the data acquisition, temperature control, calibration, and uncertainty analysis are provided in [9].…”
Section: Thermal Conductivity Measurementsmentioning
confidence: 99%
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“…The layerwise printing process creates a meso-structure with anisotropic physical properties, which gives rise to metamaterials. The anisotropic properties have been studied for the mechanical [ 29 , 30 , 31 ], thermal [ 32 , 33 ], magnetic [ 34 ], and electrical [ 35 ] domains. The anisotropy in the electrical properties can be explained by means of interfacial and inter-layer contact resistance, which is believed to originate from imperfect bonding conditions (e.g.…”
Section: Introductionmentioning
confidence: 99%